Du, M., Tang, C., Yang, J., & Yin, J. (2026). A Failure Diagnosis Method for Multichip IGBT Modules Using a Novel Chip Failure Sensitive Parameter. International Journal of Circuit Theory & Applications, 1. https://doi.org/10.1002/cta.70391
Chicago Style (17th ed.) CitationDu, Mingxing, Chudong Tang, Jianxiong Yang, and Jinliang Yin. "A Failure Diagnosis Method for Multichip IGBT Modules Using a Novel Chip Failure Sensitive Parameter." International Journal of Circuit Theory & Applications 2026: 1. https://doi.org/10.1002/cta.70391.
MLA (9th ed.) CitationDu, Mingxing, et al. "A Failure Diagnosis Method for Multichip IGBT Modules Using a Novel Chip Failure Sensitive Parameter." International Journal of Circuit Theory & Applications, 2026, p. 1, https://doi.org/10.1002/cta.70391.