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Thermally Stable, Low‐Resistance Cu Alloy Contacts for Mg3(Sb, Bi)2 Thermoelectric Materials by Two‐Step Contacting.

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Title: Thermally Stable, Low‐Resistance Cu Alloy Contacts for Mg3(Sb, Bi)2 Thermoelectric Materials by Two‐Step Contacting.
Authors: Aamir, Muhammad Fasih1,2 (AUTHOR), Babu, Jayachandran1 (AUTHOR) BABU.Jayachandran@nims.go.jp, Chetty, Raju1 (AUTHOR), Mori, Takao1,2 (AUTHOR) MORI.Takao@nims.go.jp
Source: Small Structures. Mar2026, Vol. 7 Issue 3, p1-10. 10p.
Database: Academic Search Ultimate
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ISSN:26884062
DOI:10.1002/sstr.202500730