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Thermally Stable, Low‐Resistance Cu Alloy Contacts for Mg3(Sb, Bi)2 Thermoelectric Materials by Two‐Step Contacting.

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Title: Thermally Stable, Low‐Resistance Cu Alloy Contacts for Mg3(Sb, Bi)2 Thermoelectric Materials by Two‐Step Contacting.
Authors: Aamir, Muhammad Fasih1,2 (AUTHOR), Babu, Jayachandran1 (AUTHOR) BABU.Jayachandran@nims.go.jp, Chetty, Raju1 (AUTHOR), Mori, Takao1,2 (AUTHOR) MORI.Takao@nims.go.jp
Source: Small Structures. Mar2026, Vol. 7 Issue 3, p1-10. 10p.
Database: Academic Search Ultimate
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  Data: Thermally Stable, Low‐Resistance Cu Alloy Contacts for Mg<subscript>3</subscript>(Sb, Bi)<subscript>2</subscript> Thermoelectric Materials by Two‐Step Contacting.
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  Data: <searchLink fieldCode="AR" term="%22Aamir%2C+Muhammad+Fasih%22">Aamir, Muhammad Fasih</searchLink><relatesTo>1,2</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Babu%2C+Jayachandran%22">Babu, Jayachandran</searchLink><relatesTo>1</relatesTo> (AUTHOR)<i> BABU.Jayachandran@nims.go.jp</i><br /><searchLink fieldCode="AR" term="%22Chetty%2C+Raju%22">Chetty, Raju</searchLink><relatesTo>1</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Mori%2C+Takao%22">Mori, Takao</searchLink><relatesTo>1,2</relatesTo> (AUTHOR)<i> MORI.Takao@nims.go.jp</i>
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  Data: <searchLink fieldCode="JN" term="%22Small+Structures%22">Small Structures</searchLink>. Mar2026, Vol. 7 Issue 3, p1-10. 10p.
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=asn&AN=192629960
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        Value: 10.1002/sstr.202500730
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        Text: English
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      – TitleFull: Thermally Stable, Low‐Resistance Cu Alloy Contacts for Mg3(Sb, Bi)2 Thermoelectric Materials by Two‐Step Contacting.
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            NameFull: Aamir, Muhammad Fasih
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            NameFull: Babu, Jayachandran
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              Text: Mar2026
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              Y: 2026
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