Verification of Design and Process for Optimal Large-Area Substrate Eutectic Bonding in SiP Packaging. - Gao, Mingqi; Lei, Dongyang; Zhang, Yagang; Ye, Huijie; Zhang, Yanming; Zeng, Ce; Hu, Tong; Jiang, Hai; Lu, Qian; Yang, Yueyou; Zhang, An (Solids (2673-6497), 2026)