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Development of bifurcation prediction and process emulation for warpage prediction in fan-out wafer level packaging based on material equivalence.

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Bibliographic Details
Title: Development of bifurcation prediction and process emulation for warpage prediction in fan-out wafer level packaging based on material equivalence.
Authors: Chen, Kuo-Shen1 (AUTHOR) kschen@mail.ncku.edu.tw, Lee, Yu-Chin1 (AUTHOR) yugene0325@gmail.com, Chen, Chia-Yu1 (AUTHOR) jojojo4626@gmail.com, Hsu, Shang-Feng2 (AUTHOR) Shangfeng19991224@gmail.com
Source: International Journal of Advanced Manufacturing Technology. Jun2026, p1-19. 19p.
Database: Academic Search Ultimate
Description
ISSN:02683768
DOI:10.1007/s00170-026-18418-6