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Development of bifurcation prediction and process emulation for warpage prediction in fan-out wafer level packaging based on material equivalence.

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Title: Development of bifurcation prediction and process emulation for warpage prediction in fan-out wafer level packaging based on material equivalence.
Authors: Chen, Kuo-Shen1 (AUTHOR) kschen@mail.ncku.edu.tw, Lee, Yu-Chin1 (AUTHOR) yugene0325@gmail.com, Chen, Chia-Yu1 (AUTHOR) jojojo4626@gmail.com, Hsu, Shang-Feng2 (AUTHOR) Shangfeng19991224@gmail.com
Source: International Journal of Advanced Manufacturing Technology. Jun2026, p1-19. 19p.
Database: Academic Search Ultimate
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Header DbId: asn
DbLabel: Academic Search Ultimate
An: 194287772
AccessLevel: 2
PubType: Academic Journal
PubTypeId: academicJournal
PreciseRelevancyScore: 0
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  Label: Title
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  Data: Development of bifurcation prediction and process emulation for warpage prediction in fan-out wafer level packaging based on material equivalence.
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  Data: <searchLink fieldCode="AR" term="%22Chen%2C+Kuo-Shen%22">Chen, Kuo-Shen</searchLink><relatesTo>1</relatesTo> (AUTHOR)<i> kschen@mail.ncku.edu.tw</i><br /><searchLink fieldCode="AR" term="%22Lee%2C+Yu-Chin%22">Lee, Yu-Chin</searchLink><relatesTo>1</relatesTo> (AUTHOR)<i> yugene0325@gmail.com</i><br /><searchLink fieldCode="AR" term="%22Chen%2C+Chia-Yu%22">Chen, Chia-Yu</searchLink><relatesTo>1</relatesTo> (AUTHOR)<i> jojojo4626@gmail.com</i><br /><searchLink fieldCode="AR" term="%22Hsu%2C+Shang-Feng%22">Hsu, Shang-Feng</searchLink><relatesTo>2</relatesTo> (AUTHOR)<i> Shangfeng19991224@gmail.com</i>
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  Data: <searchLink fieldCode="JN" term="%22International+Journal+of+Advanced+Manufacturing+Technology%22">International Journal of Advanced Manufacturing Technology</searchLink>. Jun2026, p1-19. 19p.
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=asn&AN=194287772
RecordInfo BibRecord:
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      – Type: doi
        Value: 10.1007/s00170-026-18418-6
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      – Code: eng
        Text: English
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        PageCount: 19
        StartPage: 1
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      – TitleFull: Development of bifurcation prediction and process emulation for warpage prediction in fan-out wafer level packaging based on material equivalence.
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          Name:
            NameFull: Chen, Kuo-Shen
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            NameFull: Lee, Yu-Chin
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            NameFull: Chen, Chia-Yu
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          Dates:
            – D: 05
              M: 06
              Text: Jun2026
              Type: published
              Y: 2026
          Identifiers:
            – Type: issn-print
              Value: 02683768
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            – TitleFull: International Journal of Advanced Manufacturing Technology
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