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Interface Engineering of Chip Surfaces via Silane Treatments for Robust Underfill Adhesion.

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Title: Interface Engineering of Chip Surfaces via Silane Treatments for Robust Underfill Adhesion.
Authors: Otgonbayar, Zambaga1 (AUTHOR), Park, Gyu‐Sik2 (AUTHOR), Oh, Won‐Chun3 (AUTHOR), Kim, Gi‐Hwan2 (AUTHOR), Ra, Yoon‐Ho2 (AUTHOR), Noh, Jungchul4 (AUTHOR), Kim, Hyung Do5 (AUTHOR) hyungdokim@photo.polym.kyoto-u.ac.jp, Kim, Myeongjin6 (AUTHOR) myeongjinkim@knu.ac.kr, Yoon, Chang‐Min1,2,7 (AUTHOR) cmyoon4321@inha.ac.kr
Source: Small Structures. May2026, Vol. 7 Issue 5, p1-11. 11p.
Database: Academic Search Ultimate
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ISSN:26884062
DOI:10.1002/sstr.70471