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Interface Engineering of Chip Surfaces via Silane Treatments for Robust Underfill Adhesion.

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Title: Interface Engineering of Chip Surfaces via Silane Treatments for Robust Underfill Adhesion.
Authors: Otgonbayar, Zambaga1 (AUTHOR), Park, Gyu‐Sik2 (AUTHOR), Oh, Won‐Chun3 (AUTHOR), Kim, Gi‐Hwan2 (AUTHOR), Ra, Yoon‐Ho2 (AUTHOR), Noh, Jungchul4 (AUTHOR), Kim, Hyung Do5 (AUTHOR) hyungdokim@photo.polym.kyoto-u.ac.jp, Kim, Myeongjin6 (AUTHOR) myeongjinkim@knu.ac.kr, Yoon, Chang‐Min1,2,7 (AUTHOR) cmyoon4321@inha.ac.kr
Source: Small Structures. May2026, Vol. 7 Issue 5, p1-11. 11p.
Database: Academic Search Ultimate
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  Data: Interface Engineering of Chip Surfaces via Silane Treatments for Robust Underfill Adhesion.
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  Data: <searchLink fieldCode="AR" term="%22Otgonbayar%2C+Zambaga%22">Otgonbayar, Zambaga</searchLink><relatesTo>1</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Park%2C+Gyu‐Sik%22">Park, Gyu‐Sik</searchLink><relatesTo>2</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Oh%2C+Won‐Chun%22">Oh, Won‐Chun</searchLink><relatesTo>3</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Kim%2C+Gi‐Hwan%22">Kim, Gi‐Hwan</searchLink><relatesTo>2</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Ra%2C+Yoon‐Ho%22">Ra, Yoon‐Ho</searchLink><relatesTo>2</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Noh%2C+Jungchul%22">Noh, Jungchul</searchLink><relatesTo>4</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Kim%2C+Hyung+Do%22">Kim, Hyung Do</searchLink><relatesTo>5</relatesTo> (AUTHOR)<i> hyungdokim@photo.polym.kyoto-u.ac.jp</i><br /><searchLink fieldCode="AR" term="%22Kim%2C+Myeongjin%22">Kim, Myeongjin</searchLink><relatesTo>6</relatesTo> (AUTHOR)<i> myeongjinkim@knu.ac.kr</i><br /><searchLink fieldCode="AR" term="%22Yoon%2C+Chang‐Min%22">Yoon, Chang‐Min</searchLink><relatesTo>1,2,7</relatesTo> (AUTHOR)<i> cmyoon4321@inha.ac.kr</i>
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  Data: <searchLink fieldCode="JN" term="%22Small+Structures%22">Small Structures</searchLink>. May2026, Vol. 7 Issue 5, p1-11. 11p.
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=asn&AN=194362555
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        Value: 10.1002/sstr.70471
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        Text: English
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              Text: May2026
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