李正灿, 君, 董., 张兴荣, 张卫水, & 纪亚彬. (2026). 智能充填技术发展应用及前景. Gold (1001-1277), 47(5), 69. https://doi.org/10.11792/hj20260510
Chicago Style (17th ed.) Citation李正灿, 董 君, 张兴荣, 张卫水, and 纪亚彬. "智能充填技术发展应用及前景." Gold (1001-1277) 47, no. 5 (2026): 69. https://doi.org/10.11792/hj20260510.
MLA (9th ed.) Citation李正灿, et al. "智能充填技术发展应用及前景." Gold (1001-1277), vol. 47, no. 5, 2026, p. 69, https://doi.org/10.11792/hj20260510.
Warning: These citations may not always be 100% accurate.
