APA (7th ed.) Citation

Mauersberger, V. W., Senf, B., & Menzel, S. (2026). Bridging the Bond: High-Sensitivity External Printed Strain Sensors for Condition Monitoring of Adhesive Joints. Sensors (14248220), 26(12), 3738. https://doi.org/10.3390/s26123738

Chicago Style (17th ed.) Citation

Mauersberger, Valentin Wilhelm, Björn Senf, and Sandra Menzel. "Bridging the Bond: High-Sensitivity External Printed Strain Sensors for Condition Monitoring of Adhesive Joints." Sensors (14248220) 26, no. 12 (2026): 3738. https://doi.org/10.3390/s26123738.

MLA (9th ed.) Citation

Mauersberger, Valentin Wilhelm, et al. "Bridging the Bond: High-Sensitivity External Printed Strain Sensors for Condition Monitoring of Adhesive Joints." Sensors (14248220), vol. 26, no. 12, 2026, p. 3738, https://doi.org/10.3390/s26123738.