Highly Vertically Oriented Graphene Microstrip Pads With Ultrahigh Through‐Plane Thermal Conductivity and Ultralow Compressive Modulus for Efficient Heat Dissipation. - Ran, Xu; Wang, Yaru; Wu, Sijia; Wang, Hejun; Shen, Junhao; Sun, Litao; Wu, Xing; Bi, Hengchang (Advanced Science, 2026)