Chang, J., Xu, C., & Dai, Y. (2026). Numerical Simulation Study on Residual Stress and Strain in the Curing and Molding of HTPB Two-Stage Solid Propellant. Polymers (20734360), 18(13), 1588. https://doi.org/10.3390/polym18131588
Chicago Style (17th ed.) CitationChang, Jinpeng, Chunguang Xu, and Yingjun Dai. "Numerical Simulation Study on Residual Stress and Strain in the Curing and Molding of HTPB Two-Stage Solid Propellant." Polymers (20734360) 18, no. 13 (2026): 1588. https://doi.org/10.3390/polym18131588.
MLA (9th ed.) CitationChang, Jinpeng, et al. "Numerical Simulation Study on Residual Stress and Strain in the Curing and Molding of HTPB Two-Stage Solid Propellant." Polymers (20734360), vol. 18, no. 13, 2026, p. 1588, https://doi.org/10.3390/polym18131588.