APA (7th ed.) Citation

Chen, K., Lee, Y., Chen, C., & Hsu, S. (2026). Development of bifurcation prediction and process emulation for warpage prediction in fan-out wafer level packaging based on material equivalence. International Journal of Advanced Manufacturing Technology, 145(1/2), 1263. https://doi.org/10.1007/s00170-026-18418-6

Chicago Style (17th ed.) Citation

Chen, Kuo-Shen, Yu-Chin Lee, Chia-Yu Chen, and Shang-Feng Hsu. "Development of Bifurcation Prediction and Process Emulation for Warpage Prediction in Fan-out Wafer Level Packaging Based on Material Equivalence." International Journal of Advanced Manufacturing Technology 145, no. 1/2 (2026): 1263. https://doi.org/10.1007/s00170-026-18418-6.

MLA (9th ed.) Citation

Chen, Kuo-Shen, et al. "Development of Bifurcation Prediction and Process Emulation for Warpage Prediction in Fan-out Wafer Level Packaging Based on Material Equivalence." International Journal of Advanced Manufacturing Technology, vol. 145, no. 1/2, 2026, p. 1263, https://doi.org/10.1007/s00170-026-18418-6.