Lin, Y., Zhong, W., Calzada, S. E., Lach, T. G., Nuckols, L. J., Parish, C. M., . . . Burke, M. G. (2026). Flash electropolishing for TEM: Reducing FIB‐induced defects in tungsten with protocols for new materials#. Journal of Microscopy, 303(2), 154. https://doi.org/10.1111/jmi.70122
Chicago Style (17th ed.) CitationLin, Yan‐Ru, Weicheng Zhong, Sabrina E. Calzada, Timothy G. Lach, Lauren J. Nuckols, Chad M. Parish, Steven J. Zinkle, and M. Grace Burke. "Flash Electropolishing for TEM: Reducing FIB‐induced Defects in Tungsten with Protocols for New Materials#." Journal of Microscopy 303, no. 2 (2026): 154. https://doi.org/10.1111/jmi.70122.
MLA (9th ed.) CitationLin, Yan‐Ru, et al. "Flash Electropolishing for TEM: Reducing FIB‐induced Defects in Tungsten with Protocols for New Materials#." Journal of Microscopy, vol. 303, no. 2, 2026, p. 154, https://doi.org/10.1111/jmi.70122.