APA (7th ed.) Citation

SUBRAMANIAN, K. N. (2007). Role of anisotropic behaviour of Sn on thermomechanical fatigue and fracture of Sn-based solder joints under thermal excursions. Fatigue & Fracture of Engineering Materials & Structures, 30(5), 420. https://doi.org/10.1111/j.1460-2695.2006.01070.x

Chicago Style (17th ed.) Citation

SUBRAMANIAN, K. N. "Role of Anisotropic Behaviour of Sn on Thermomechanical Fatigue and Fracture of Sn-based Solder Joints Under Thermal Excursions." Fatigue & Fracture of Engineering Materials & Structures 30, no. 5 (2007): 420. https://doi.org/10.1111/j.1460-2695.2006.01070.x.

MLA (9th ed.) Citation

SUBRAMANIAN, K. N. "Role of Anisotropic Behaviour of Sn on Thermomechanical Fatigue and Fracture of Sn-based Solder Joints Under Thermal Excursions." Fatigue & Fracture of Engineering Materials & Structures, vol. 30, no. 5, 2007, p. 420, https://doi.org/10.1111/j.1460-2695.2006.01070.x.