Role of anisotropic behaviour of Sn on thermomechanical fatigue and fracture of Sn-based solder joints under thermal excursions.

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Title: Role of anisotropic behaviour of Sn on thermomechanical fatigue and fracture of Sn-based solder joints under thermal excursions.
Authors: SUBRAMANIAN, K. N.1 subraman@egr.msu.edu
Source: Fatigue & Fracture of Engineering Materials & Structures. May2007, Vol. 30 Issue 5, p420-431. 12p. 14 Diagrams, 2 Charts, 5 Graphs.
Database: Academic Search Ultimate
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  Data: Role of anisotropic behaviour of Sn on thermomechanical fatigue and fracture of Sn-based solder joints under thermal excursions.
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PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=asn&AN=24826124
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      – Type: doi
        Value: 10.1111/j.1460-2695.2006.01070.x
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      – Code: eng
        Text: English
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        PageCount: 12
        StartPage: 420
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      – TitleFull: Role of anisotropic behaviour of Sn on thermomechanical fatigue and fracture of Sn-based solder joints under thermal excursions.
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              Text: May2007
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