Study of low temperature MOCVD deposition of TiN barrier layer for copper diffusion in high aspect ratio through silicon vias. - Djomeni, Larissa; Mourier, Thierry; Minoret, StÃ©phane; Fadloun, Sabrina; Piallat, Fabien; Burgess, Steve; Price, Andrew; Zhou, Yun; Jones, Christopher; Mathiot, Daniel; Maitrejean, Sylvain (Microelectronic Engineering, 2014)