Rework and Reball Challenges for Wafer-Level Packages.

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Bibliographic Details
Title:	Rework and Reball Challenges for Wafer-Level Packages.
Authors:	Cummings, Lauren¹, Dobriyal, Priyanka¹
Source:	SMT: Surface Mount Technology. Sep2017, Vol. 32 Issue 9, p50-62. 10p.
Database:	Business Source Ultimate

Description
ISSN:	15298930