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一种 K 波段晶圆级封装器件化 R 组件设计.

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Title: 一种 K 波段晶圆级封装器件化 R 组件设计.
Alternate Title: Design of a K-band Wafer-level Package Rx Module.
Authors: 朱贵德1 zhugd369750313@163.com, 罗 鑫1, 王军会1, 罗 里1, 何小峰1
Source: Telecommunication Engineering. 6/28/2025, Vol. 65 Issue 6, p980-985. 6p.
Database: Business Source Ultimate
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  Data: Design of a K-band Wafer-level Package Rx Module.
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  Data: <searchLink fieldCode="JN" term="%22Telecommunication+Engineering%22">Telecommunication Engineering</searchLink>. 6/28/2025, Vol. 65 Issue 6, p980-985. 6p.
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