The Future of Data Center Cooling: Embracing Liquid Cooling for High-Density AI Workloads.

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Bibliographic Details
Title:	The Future of Data Center Cooling: Embracing Liquid Cooling for High-Density AI Workloads.
Authors:	Kumar, Roopesh¹
Source:	Dataquest. Jul2025, Vol. 41 Issue 7, p18-19. 2p.
Database:	Business Source Ultimate

Description
ISSN:	0970034X