Solving the Toughest BGA Challenges in Electronics.
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| Title: | Solving the Toughest BGA Challenges in Electronics. |
|---|---|
| Authors: | Bell, Nash1,2 |
| Source: | SMT007 Magazine. Jul2025, Vol. 40 Issue 7, p34-40. 5p. |
| Database: | Business Source Ultimate |
| FullText | Text: Availability: 0 |
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| Header | DbId: bsu DbLabel: Business Source Ultimate An: 187253501 AccessLevel: 2 PubType: Periodical PubTypeId: serialPeriodical PreciseRelevancyScore: 0 |
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| PLink | https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=bsu&AN=187253501 |
| RecordInfo | BibRecord: BibEntity: Languages: – Code: eng Text: English PhysicalDescription: Pagination: PageCount: 5 StartPage: 34 Titles: – TitleFull: Solving the Toughest BGA Challenges in Electronics. Type: main BibRelationships: HasContributorRelationships: – PersonEntity: Name: NameFull: Bell, Nash IsPartOfRelationships: – BibEntity: Dates: – D: 01 M: 07 Text: Jul2025 Type: published Y: 2025 Numbering: – Type: volume Value: 40 – Type: issue Value: 7 Titles: – TitleFull: SMT007 Magazine Type: main |
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