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双层堆叠 SIP 封装工艺在隔离 DC / DC 变换器中的应用.

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Bibliographic Details
Title: 双层堆叠 SIP 封装工艺在隔离 DC / DC 变换器中的应用.
Alternate Title: Application of Dual-layer Stacked SIP Packaging Technology in Isolated DC/DC Power Converters.
Authors: 王玉宝1 wybfirefly@163.com, 宋义雄1
Source: Telecommunication Engineering. 1/28/2026, Vol. 66 Issue 1, p148-151. 4p.
Database: Business Source Ultimate
Description
ISSN:1001893X
DOI:10.20079/j.issn.1001-893x.250530003