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双层堆叠 SIP 封装工艺在隔离 DC / DC 变换器中的应用.

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Title: 双层堆叠 SIP 封装工艺在隔离 DC / DC 变换器中的应用.
Alternate Title: Application of Dual-layer Stacked SIP Packaging Technology in Isolated DC/DC Power Converters.
Authors: 王玉宝1 wybfirefly@163.com, 宋义雄1
Source: Telecommunication Engineering. 1/28/2026, Vol. 66 Issue 1, p148-151. 4p.
Database: Business Source Ultimate
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  Data: Application of Dual-layer Stacked SIP Packaging Technology in Isolated DC/DC Power Converters.
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  Data: <searchLink fieldCode="JN" term="%22Telecommunication+Engineering%22">Telecommunication Engineering</searchLink>. 1/28/2026, Vol. 66 Issue 1, p148-151. 4p.
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        Value: 10.20079/j.issn.1001-893x.250530003
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      – Code: chi
        Text: Chinese
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        StartPage: 148
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      – TitleFull: 双层堆叠 SIP 封装工艺在隔离 DC / DC 变换器中的应用.
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            NameFull: 王玉宝
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            NameFull: 宋义雄
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            – D: 28
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              Text: 1/28/2026
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              Y: 2026
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