3D-Bulk-RRAM für KI-Anwendungen.
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| Title: | 3D-Bulk-RRAM für KI-Anwendungen. |
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| Source: | Elektronik Industrie. 3/3/2026, Issue 3, p66-66. 1p. |
| Database: | Business Source Ultimate |
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| FullText | Links: – Type: pdflink Text: Availability: 1 |
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| Header | DbId: bsu DbLabel: Business Source Ultimate An: 192053553 AccessLevel: 2 PubType: Academic Journal PubTypeId: academicJournal PreciseRelevancyScore: 0 |
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| PLink | https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=bsu&AN=192053553 |
| RecordInfo | BibRecord: BibEntity: Languages: – Code: ger Text: German PhysicalDescription: Pagination: PageCount: 1 StartPage: 66 Titles: – TitleFull: 3D-Bulk-RRAM für KI-Anwendungen. Type: main BibRelationships: IsPartOfRelationships: – BibEntity: Dates: – D: 03 M: 03 Text: 3/3/2026 Type: published Y: 2026 Identifiers: – Type: issn-print Value: 01745522 Numbering: – Type: issue Value: 3 Titles: – TitleFull: Elektronik Industrie Type: main |
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