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L-shaped epoxy reinforcement optimization for vibration reliability of microspring array pins in aerospace large-scale integrated circuits.

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Title: L-shaped epoxy reinforcement optimization for vibration reliability of microspring array pins in aerospace large-scale integrated circuits.
Authors: Xiang, Yuyan1 (AUTHOR) 1049840307@qq.com, Jingming, Fei1 (AUTHOR) fjmhit@163.com, Hongmei, Zhang1 (AUTHOR) 18333606193@163.com, Qi, An1 (AUTHOR) 805525071@qq.com
Source: Soldering & Surface Mount Technology. 2026, Vol. 38 Issue 4, p245-256. 12p.
Database: Business Source Ultimate
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  Availability: 0
Header DbId: bsu
DbLabel: Business Source Ultimate
An: 194604081
AccessLevel: 2
PubType: Academic Journal
PubTypeId: academicJournal
PreciseRelevancyScore: 0
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  Data: L-shaped epoxy reinforcement optimization for vibration reliability of microspring array pins in aerospace large-scale integrated circuits.
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  Data: <searchLink fieldCode="AR" term="%22Xiang%2C+Yuyan%22">Xiang, Yuyan</searchLink><relatesTo>1</relatesTo> (AUTHOR)<i> 1049840307@qq.com</i><br /><searchLink fieldCode="AR" term="%22Jingming%2C+Fei%22">Jingming, Fei</searchLink><relatesTo>1</relatesTo> (AUTHOR)<i> fjmhit@163.com</i><br /><searchLink fieldCode="AR" term="%22Hongmei%2C+Zhang%22">Hongmei, Zhang</searchLink><relatesTo>1</relatesTo> (AUTHOR)<i> 18333606193@163.com</i><br /><searchLink fieldCode="AR" term="%22Qi%2C+An%22">Qi, An</searchLink><relatesTo>1</relatesTo> (AUTHOR)<i> 805525071@qq.com</i>
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  Data: <searchLink fieldCode="JN" term="%22Soldering+%26+Surface+Mount+Technology%22">Soldering & Surface Mount Technology</searchLink>. 2026, Vol. 38 Issue 4, p245-256. 12p.
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=bsu&AN=194604081
RecordInfo BibRecord:
  BibEntity:
    Languages:
      – Code: eng
        Text: English
    PhysicalDescription:
      Pagination:
        PageCount: 12
        StartPage: 245
    Titles:
      – TitleFull: L-shaped epoxy reinforcement optimization for vibration reliability of microspring array pins in aerospace large-scale integrated circuits.
        Type: main
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      – PersonEntity:
          Name:
            NameFull: Xiang, Yuyan
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            NameFull: Jingming, Fei
      – PersonEntity:
          Name:
            NameFull: Hongmei, Zhang
      – PersonEntity:
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            NameFull: Qi, An
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            – D: 01
              M: 07
              Text: 2026
              Type: published
              Y: 2026
          Identifiers:
            – Type: issn-print
              Value: 09540911
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              Value: 38
            – Type: issue
              Value: 4
          Titles:
            – TitleFull: Soldering & Surface Mount Technology
              Type: main
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