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Scheduling and Analysis of Start-Up Transient Processes for Dual-Arm Cluster Tools With Wafer Revisiting.

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Title: Scheduling and Analysis of Start-Up Transient Processes for Dual-Arm Cluster Tools With Wafer Revisiting.
Authors: Pan, Chun Rong1, Qiao, Yan2, Zhou, Meng Chu3, Wu, Nai Qi4
Source: IEEE Transactions on Semiconductor Manufacturing. May2015, Vol. 28 Issue 2, p160-170. 11p.
Subjects: Production scheduling, Semiconductor wafers, Nanofabrication, Atomic layer deposition, Steady state conduction, Mathematical optimization
Abstract: The trends of increasing wafer diameter and smaller lot sizes have led to more transient periods in wafer fabrication. For some wafer fabrication processes, such as atomic layer deposition, wafers need to visit some process modules for a number of times, instead of once, thus leading to a so-called revisiting process. Most previous studies on cluster tool scheduling focus on steady state at which cluster tools repeat identical cycles. Research on transient processes of dual-arm cluster tools with wafer revisiting processes becomes urgently needed for high-performance wafer fabrication. In order to speed up start-up transient processes, this paper adopts a program evaluation and review technique for the analysis of start-up transient processes and develops optimization algorithms for their scheduling of dual-arm cluster tools. Then, their complexity is analyzed. Finally, illustrative examples are given to show the applications of the proposed method. [ABSTRACT FROM AUTHOR]
Copyright of IEEE Transactions on Semiconductor Manufacturing is the property of IEEE and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.)
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  Data: <searchLink fieldCode="JN" term="%22IEEE+Transactions+on+Semiconductor+Manufacturing%22">IEEE Transactions on Semiconductor Manufacturing</searchLink>. May2015, Vol. 28 Issue 2, p160-170. 11p.
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  Data: <searchLink fieldCode="DE" term="%22Production+scheduling%22">Production scheduling</searchLink><br /><searchLink fieldCode="DE" term="%22Semiconductor+wafers%22">Semiconductor wafers</searchLink><br /><searchLink fieldCode="DE" term="%22Nanofabrication%22">Nanofabrication</searchLink><br /><searchLink fieldCode="DE" term="%22Atomic+layer+deposition%22">Atomic layer deposition</searchLink><br /><searchLink fieldCode="DE" term="%22Steady+state+conduction%22">Steady state conduction</searchLink><br /><searchLink fieldCode="DE" term="%22Mathematical+optimization%22">Mathematical optimization</searchLink>
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  Data: The trends of increasing wafer diameter and smaller lot sizes have led to more transient periods in wafer fabrication. For some wafer fabrication processes, such as atomic layer deposition, wafers need to visit some process modules for a number of times, instead of once, thus leading to a so-called revisiting process. Most previous studies on cluster tool scheduling focus on steady state at which cluster tools repeat identical cycles. Research on transient processes of dual-arm cluster tools with wafer revisiting processes becomes urgently needed for high-performance wafer fabrication. In order to speed up start-up transient processes, this paper adopts a program evaluation and review technique for the analysis of start-up transient processes and develops optimization algorithms for their scheduling of dual-arm cluster tools. Then, their complexity is analyzed. Finally, illustrative examples are given to show the applications of the proposed method. [ABSTRACT FROM AUTHOR]
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  Data: <i>Copyright of IEEE Transactions on Semiconductor Manufacturing is the property of IEEE and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract.</i> (Copyright applies to all Abstracts.)
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        Value: 10.1109/TSM.2015.2390644
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        Type: general
      – SubjectFull: Nanofabrication
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      – SubjectFull: Atomic layer deposition
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      – SubjectFull: Steady state conduction
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      – SubjectFull: Mathematical optimization
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              Text: May2015
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