APA (7th ed.) Citation

Qiao, Y., Pan, C., Wu, N., & Zhou, M. (2015). Response Policies to Process Module Failure in Single-Arm Cluster Tools Subject to Wafer Residency Time Constraints. IEEE Transactions on Automation Science & Engineering, 12(3), 1125. https://doi.org/10.1109/TASE.2014.2312823

Chicago Style (17th ed.) Citation

Qiao, Yan, Chun-Rong Pan, Nai-Qi Wu, and MengChu Zhou. "Response Policies to Process Module Failure in Single-Arm Cluster Tools Subject to Wafer Residency Time Constraints." IEEE Transactions on Automation Science & Engineering 12, no. 3 (2015): 1125. https://doi.org/10.1109/TASE.2014.2312823.

MLA (9th ed.) Citation

Qiao, Yan, et al. "Response Policies to Process Module Failure in Single-Arm Cluster Tools Subject to Wafer Residency Time Constraints." IEEE Transactions on Automation Science & Engineering, vol. 12, no. 3, 2015, p. 1125, https://doi.org/10.1109/TASE.2014.2312823.