Numerical simulation of flexible micro-bending processes with consideration of grain structure.
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| Title: | Numerical simulation of flexible micro-bending processes with consideration of grain structure. |
|---|---|
| Authors: | Wang, Xiao1 wx@ujs.edu.cn, Qian, Qing1, Shen, Zongbao1, Li, JianWen1, Zhang, Hongfeng1, Liu, Huixia1 |
| Source: | Computational Materials Science. Dec2015, Vol. 110, p134-143. 10p. |
| Subjects: | Microbending, Computer simulation, Crystal grain boundaries, Crystal structure, Finite element method, Grain size |
| Abstract: | A finite element model of the flexible micro-bending process based on various grain sizes of pure copper is developed. The geometrical model of grain structure is established with Voronoi tessellation, which is employed to describe the polycrystalline aggregation. A model based on dislocation density is adopted to describe the flow stress of grain interior (GI) and grain boundary (GB) quantitatively. In this paper, silicon rubber is used as the flexible punch and four annealing conditions of pure copper as the workpieces, respectively. The influence of grain structure and grain size is discussed. It is observed that as the ratio of workpiece thickness ( t ) to grain size ( d ) decreases, the forming depth increases. The inhomogeneous deformation occurs in the coarse-grained micro-parts. Furthermore, the results indicate that the surface asperity increases with grain size. The numerical simulation results agree well with the tendency of experimental results. During the micro-bending process, the phenomenon of stress concentration occurs at the grain boundary of the micro-parts. The maximum von mises stress appears at the grain boundary located at the fillet position. The maximum von mises plastic strain primarily concentrates on the junction of the grain interior and grain boundary in the fine-grained parts, while it concentrates at the surface of the grain interior in the coarse-grained parts. [ABSTRACT FROM AUTHOR] |
| Copyright of Computational Materials Science is the property of Elsevier B.V. and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.) | |
| Database: | Engineering Source |
| FullText | Text: Availability: 0 |
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| Header | DbId: egs DbLabel: Engineering Source An: 109914082 AccessLevel: 6 PubType: Academic Journal PubTypeId: academicJournal PreciseRelevancyScore: 0 |
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| Items | – Name: Title Label: Title Group: Ti Data: Numerical simulation of flexible micro-bending processes with consideration of grain structure. – Name: Author Label: Authors Group: Au Data: <searchLink fieldCode="AR" term="%22Wang%2C+Xiao%22">Wang, Xiao</searchLink><relatesTo>1</relatesTo><i> wx@ujs.edu.cn</i><br /><searchLink fieldCode="AR" term="%22Qian%2C+Qing%22">Qian, Qing</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AR" term="%22Shen%2C+Zongbao%22">Shen, Zongbao</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AR" term="%22Li%2C+JianWen%22">Li, JianWen</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AR" term="%22Zhang%2C+Hongfeng%22">Zhang, Hongfeng</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AR" term="%22Liu%2C+Huixia%22">Liu, Huixia</searchLink><relatesTo>1</relatesTo> – Name: TitleSource Label: Source Group: Src Data: <searchLink fieldCode="JN" term="%22Computational+Materials+Science%22">Computational Materials Science</searchLink>. Dec2015, Vol. 110, p134-143. 10p. – Name: Subject Label: Subjects Group: Su Data: <searchLink fieldCode="DE" term="%22Microbending%22">Microbending</searchLink><br /><searchLink fieldCode="DE" term="%22Computer+simulation%22">Computer simulation</searchLink><br /><searchLink fieldCode="DE" term="%22Crystal+grain+boundaries%22">Crystal grain boundaries</searchLink><br /><searchLink fieldCode="DE" term="%22Crystal+structure%22">Crystal structure</searchLink><br /><searchLink fieldCode="DE" term="%22Finite+element+method%22">Finite element method</searchLink><br /><searchLink fieldCode="DE" term="%22Grain+size%22">Grain size</searchLink> – Name: Abstract Label: Abstract Group: Ab Data: A finite element model of the flexible micro-bending process based on various grain sizes of pure copper is developed. The geometrical model of grain structure is established with Voronoi tessellation, which is employed to describe the polycrystalline aggregation. A model based on dislocation density is adopted to describe the flow stress of grain interior (GI) and grain boundary (GB) quantitatively. In this paper, silicon rubber is used as the flexible punch and four annealing conditions of pure copper as the workpieces, respectively. The influence of grain structure and grain size is discussed. It is observed that as the ratio of workpiece thickness ( t ) to grain size ( d ) decreases, the forming depth increases. The inhomogeneous deformation occurs in the coarse-grained micro-parts. Furthermore, the results indicate that the surface asperity increases with grain size. The numerical simulation results agree well with the tendency of experimental results. During the micro-bending process, the phenomenon of stress concentration occurs at the grain boundary of the micro-parts. The maximum von mises stress appears at the grain boundary located at the fillet position. The maximum von mises plastic strain primarily concentrates on the junction of the grain interior and grain boundary in the fine-grained parts, while it concentrates at the surface of the grain interior in the coarse-grained parts. [ABSTRACT FROM AUTHOR] – Name: AbstractSuppliedCopyright Label: Group: Ab Data: <i>Copyright of Computational Materials Science is the property of Elsevier B.V. and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract.</i> (Copyright applies to all Abstracts.) |
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| RecordInfo | BibRecord: BibEntity: Identifiers: – Type: doi Value: 10.1016/j.commatsci.2015.08.030 Languages: – Code: eng Text: English PhysicalDescription: Pagination: PageCount: 10 StartPage: 134 Subjects: – SubjectFull: Microbending Type: general – SubjectFull: Computer simulation Type: general – SubjectFull: Crystal grain boundaries Type: general – SubjectFull: Crystal structure Type: general – SubjectFull: Finite element method Type: general – SubjectFull: Grain size Type: general Titles: – TitleFull: Numerical simulation of flexible micro-bending processes with consideration of grain structure. Type: main BibRelationships: HasContributorRelationships: – PersonEntity: Name: NameFull: Wang, Xiao – PersonEntity: Name: NameFull: Qian, Qing – PersonEntity: Name: NameFull: Shen, Zongbao – PersonEntity: Name: NameFull: Li, JianWen – PersonEntity: Name: NameFull: Zhang, Hongfeng – PersonEntity: Name: NameFull: Liu, Huixia IsPartOfRelationships: – BibEntity: Dates: – D: 01 M: 12 Text: Dec2015 Type: published Y: 2015 Identifiers: – Type: issn-print Value: 09270256 Numbering: – Type: volume Value: 110 Titles: – TitleFull: Computational Materials Science Type: main |
| ResultId | 1 |
