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Modelling of the Polished Profile in Computer-Controlled Polishing by a Sub-Aperture Pad.

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Title: Modelling of the Polished Profile in Computer-Controlled Polishing by a Sub-Aperture Pad.
Authors: Fan, Cheng1,2 (AUTHOR), Zhao, Ji1 (AUTHOR) jzhao@jlu.edu.cn, Zhang, Lei1 (AUTHOR), Zhou, Wansong1 (AUTHOR), Wu, Jichuan3 (AUTHOR)
Source: Machining Science & Technology. 2015, Vol. 19 Issue 4, p536-558. 23p.
Subjects: Grinding & polishing, Computer-control machine tool operators, Computers in mechanical engineering, Surfaces (Technology), Spindles (Machine tools)
Abstract: High-quality part surfaces with high surface finish and form accuracy are increasingly in demand in the mold/die and optics industries. The computer-controlled polishing (CCP) is commonly used as the final procedure to improve the surface quality. This paper presents a theoretical and experimental study on the polished profile of CCP with sub-aperture pad. A material removal model is proposed based on the evaluation of the amount of material removed from the surface along a direction orthogonal to the tool path. The model assumes that the material removal rate follows the Peterson equation. The distribution of the sliding velocity at the contact region is presented. On the basis above, the approaches to calculate the polished profiles are developed for the sub-aperture pad polishing along a straight path and a curved path. The model is validated by a series of designed polishing experiments, which reveals that polishing normal force, angular spindle velocity, feed rate and polishing path all have effects on the polished profile. The result of experiments demonstrates the capability of the model-based simulation in predicting the polished profile. [ABSTRACT FROM PUBLISHER]
Copyright of Machining Science & Technology is the property of Taylor & Francis Ltd and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.)
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  Data: Modelling of the Polished Profile in Computer-Controlled Polishing by a Sub-Aperture Pad.
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  Data: <searchLink fieldCode="AR" term="%22Fan%2C+Cheng%22">Fan, Cheng</searchLink><relatesTo>1,2</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Zhao%2C+Ji%22">Zhao, Ji</searchLink><relatesTo>1</relatesTo> (AUTHOR)<i> jzhao@jlu.edu.cn</i><br /><searchLink fieldCode="AR" term="%22Zhang%2C+Lei%22">Zhang, Lei</searchLink><relatesTo>1</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Zhou%2C+Wansong%22">Zhou, Wansong</searchLink><relatesTo>1</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Wu%2C+Jichuan%22">Wu, Jichuan</searchLink><relatesTo>3</relatesTo> (AUTHOR)
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  Data: <searchLink fieldCode="JN" term="%22Machining+Science+%26+Technology%22">Machining Science & Technology</searchLink>. 2015, Vol. 19 Issue 4, p536-558. 23p.
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  Data: <searchLink fieldCode="DE" term="%22Grinding+%26+polishing%22">Grinding & polishing</searchLink><br /><searchLink fieldCode="DE" term="%22Computer-control+machine+tool+operators%22">Computer-control machine tool operators</searchLink><br /><searchLink fieldCode="DE" term="%22Computers+in+mechanical+engineering%22">Computers in mechanical engineering</searchLink><br /><searchLink fieldCode="DE" term="%22Surfaces+%28Technology%29%22">Surfaces (Technology)</searchLink><br /><searchLink fieldCode="DE" term="%22Spindles+%28Machine+tools%29%22">Spindles (Machine tools)</searchLink>
– Name: Abstract
  Label: Abstract
  Group: Ab
  Data: High-quality part surfaces with high surface finish and form accuracy are increasingly in demand in the mold/die and optics industries. The computer-controlled polishing (CCP) is commonly used as the final procedure to improve the surface quality. This paper presents a theoretical and experimental study on the polished profile of CCP with sub-aperture pad. A material removal model is proposed based on the evaluation of the amount of material removed from the surface along a direction orthogonal to the tool path. The model assumes that the material removal rate follows the Peterson equation. The distribution of the sliding velocity at the contact region is presented. On the basis above, the approaches to calculate the polished profiles are developed for the sub-aperture pad polishing along a straight path and a curved path. The model is validated by a series of designed polishing experiments, which reveals that polishing normal force, angular spindle velocity, feed rate and polishing path all have effects on the polished profile. The result of experiments demonstrates the capability of the model-based simulation in predicting the polished profile. [ABSTRACT FROM PUBLISHER]
– Name: AbstractSuppliedCopyright
  Label:
  Group: Ab
  Data: <i>Copyright of Machining Science & Technology is the property of Taylor & Francis Ltd and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract.</i> (Copyright applies to all Abstracts.)
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RecordInfo BibRecord:
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    Identifiers:
      – Type: doi
        Value: 10.1080/10910344.2015.1085311
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      – Code: eng
        Text: English
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        PageCount: 23
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      – SubjectFull: Grinding & polishing
        Type: general
      – SubjectFull: Computer-control machine tool operators
        Type: general
      – SubjectFull: Computers in mechanical engineering
        Type: general
      – SubjectFull: Surfaces (Technology)
        Type: general
      – SubjectFull: Spindles (Machine tools)
        Type: general
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      – TitleFull: Modelling of the Polished Profile in Computer-Controlled Polishing by a Sub-Aperture Pad.
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            NameFull: Fan, Cheng
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            NameFull: Zhao, Ji
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            NameFull: Zhang, Lei
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            NameFull: Zhou, Wansong
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            NameFull: Wu, Jichuan
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              M: 10
              Text: 2015
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