Modeling of moisture over-saturation and vapor pressure in die-attach film for stacked-die chip scale packages.
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| Title: | Modeling of moisture over-saturation and vapor pressure in die-attach film for stacked-die chip scale packages. |
|---|---|
| Authors: | Chen, Liangbiao1, Adams, Jeremy1, Chu, Hsing-Wei1, Fan, Xuejun xuejun.fan@lamar.edu |
| Source: | Journal of Materials Science: Materials in Electronics. Jan2016, Vol. 27 Issue 1, p481-488. 8p. |
| Subjects: | Saturation vapor pressure, Chip scale packaging, Transport equation, Thin films, Permeability, Solder & soldering |
| Abstract: | Die-attach film failure during soldering reflow is of particular concern for reliability of 3D ultra-thin stacked-die chip scale packages (CSPs), as extremely high vapor pressure can be generated from vaporized moisture to cause severe damages. Under rapid heating, pressure-driven moisture vapor flow could become as significant as concentration-driven diffusion, and should be included in moisture transport models. In this study, a convection-diffusion (CD) model is presented for analyzing vapor pressure and moisture behavior of soft die-attach films for 3D CSPs, with both vapor flow and the effect of temperature on saturated moisture content considered. By using a 1D model according to experimental observations, the over-saturation phenomenon in the thin film and vapor pressure evolution are investigated. It is found that the reflow profiles and substrate thickness could have great impact on the magnitude of vapor pressure, which agrees well with the experimental results. Sensitivity analyses show that a high vapor permeability and a large porosity could lead to low vapor pressure. Being a vapor pressure-based model, the CD model is suitable to study multiple-material systems without discontinuity issue at the material boundary. It is concluded that the CD model could serve as an effective method for predicting vapor pressure and moisture behaviors during soldering reflow for 3D stacked-die CSPs. [ABSTRACT FROM AUTHOR] |
| Copyright of Journal of Materials Science: Materials in Electronics is the property of Springer Nature and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.) | |
| Database: | Engineering Source |
| FullText | Links: – Type: pdflink Text: Availability: 0 |
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| Header | DbId: egs DbLabel: Engineering Source An: 112213731 AccessLevel: 6 PubType: Academic Journal PubTypeId: academicJournal PreciseRelevancyScore: 0 |
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| Items | – Name: Title Label: Title Group: Ti Data: Modeling of moisture over-saturation and vapor pressure in die-attach film for stacked-die chip scale packages. – Name: Author Label: Authors Group: Au Data: <searchLink fieldCode="AR" term="%22Chen%2C+Liangbiao%22">Chen, Liangbiao</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AR" term="%22Adams%2C+Jeremy%22">Adams, Jeremy</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AR" term="%22Chu%2C+Hsing-Wei%22">Chu, Hsing-Wei</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AR" term="%22Fan%2C+Xuejun%22">Fan, Xuejun</searchLink><i> xuejun.fan@lamar.edu</i> – Name: TitleSource Label: Source Group: Src Data: <searchLink fieldCode="JN" term="%22Journal+of+Materials+Science%3A+Materials+in+Electronics%22">Journal of Materials Science: Materials in Electronics</searchLink>. Jan2016, Vol. 27 Issue 1, p481-488. 8p. – Name: Subject Label: Subjects Group: Su Data: <searchLink fieldCode="DE" term="%22Saturation+vapor+pressure%22">Saturation vapor pressure</searchLink><br /><searchLink fieldCode="DE" term="%22Chip+scale+packaging%22">Chip scale packaging</searchLink><br /><searchLink fieldCode="DE" term="%22Transport+equation%22">Transport equation</searchLink><br /><searchLink fieldCode="DE" term="%22Thin+films%22">Thin films</searchLink><br /><searchLink fieldCode="DE" term="%22Permeability%22">Permeability</searchLink><br /><searchLink fieldCode="DE" term="%22Solder+%26+soldering%22">Solder & soldering</searchLink> – Name: Abstract Label: Abstract Group: Ab Data: Die-attach film failure during soldering reflow is of particular concern for reliability of 3D ultra-thin stacked-die chip scale packages (CSPs), as extremely high vapor pressure can be generated from vaporized moisture to cause severe damages. Under rapid heating, pressure-driven moisture vapor flow could become as significant as concentration-driven diffusion, and should be included in moisture transport models. In this study, a convection-diffusion (CD) model is presented for analyzing vapor pressure and moisture behavior of soft die-attach films for 3D CSPs, with both vapor flow and the effect of temperature on saturated moisture content considered. By using a 1D model according to experimental observations, the over-saturation phenomenon in the thin film and vapor pressure evolution are investigated. It is found that the reflow profiles and substrate thickness could have great impact on the magnitude of vapor pressure, which agrees well with the experimental results. Sensitivity analyses show that a high vapor permeability and a large porosity could lead to low vapor pressure. Being a vapor pressure-based model, the CD model is suitable to study multiple-material systems without discontinuity issue at the material boundary. It is concluded that the CD model could serve as an effective method for predicting vapor pressure and moisture behaviors during soldering reflow for 3D stacked-die CSPs. [ABSTRACT FROM AUTHOR] – Name: AbstractSuppliedCopyright Label: Group: Ab Data: <i>Copyright of Journal of Materials Science: Materials in Electronics is the property of Springer Nature and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract.</i> (Copyright applies to all Abstracts.) |
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| RecordInfo | BibRecord: BibEntity: Identifiers: – Type: doi Value: 10.1007/s10854-015-3778-5 Languages: – Code: eng Text: English PhysicalDescription: Pagination: PageCount: 8 StartPage: 481 Subjects: – SubjectFull: Saturation vapor pressure Type: general – SubjectFull: Chip scale packaging Type: general – SubjectFull: Transport equation Type: general – SubjectFull: Thin films Type: general – SubjectFull: Permeability Type: general – SubjectFull: Solder & soldering Type: general Titles: – TitleFull: Modeling of moisture over-saturation and vapor pressure in die-attach film for stacked-die chip scale packages. Type: main BibRelationships: HasContributorRelationships: – PersonEntity: Name: NameFull: Chen, Liangbiao – PersonEntity: Name: NameFull: Adams, Jeremy – PersonEntity: Name: NameFull: Chu, Hsing-Wei – PersonEntity: Name: NameFull: Fan, Xuejun IsPartOfRelationships: – BibEntity: Dates: – D: 01 M: 01 Text: Jan2016 Type: published Y: 2016 Identifiers: – Type: issn-print Value: 09574522 Numbering: – Type: volume Value: 27 – Type: issue Value: 1 Titles: – TitleFull: Journal of Materials Science: Materials in Electronics Type: main |
| ResultId | 1 |
