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Copper uptake by silica and iron oxide under high surface coverage conditions: surface charge and sorption equilibrium modeling

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Bibliographic Details
Title:	Copper uptake by silica and iron oxide under high surface coverage conditions: surface charge and sorption equilibrium modeling
Authors:	Subramaniam, Kavitha¹, Vithayaveroj, Viriya¹, Yiacoumi, Sotira¹ syiacoumi@ce.gatech.edu, Tsouris, Costas²
Source:	Journal of Colloid & Interface Science. Dec2003, Vol. 268 Issue 1, p12. 11p.
Subjects:	Absorption, Surface defects, Electrostatics, Colloids, Silica
Abstract:	A sorption modeling approach based on surface complexation concepts was applied to predict copper uptake and its effects on the surface electrostatic potential of ferric oxide and silica colloids. Equilibrium modeling of copper uptake by ferric oxide using the traditional surface complexation model (SCM) was reasonably successful with some discrepancies especially in the acidic pH ranges and high colloid concentration cases. Good predictions of the ferric oxide charge reversals during uptake were obtained from the modeling. Based on the SCM predictions, copper removal from solution is due to the outer-sphere complexation of the first hydrolysis product, resulting in the surface-metal complex SO−CuOH+. The SCM was found to be insufficient to describe copper uptake by silica particles. To address discrepancies between experimental data and SCM predictions, the SCM was modified to include attributes of the surface polymer model (SPM), which incorporates sorption of the dimeric copper species Cu2(OH)22+. The continuum model (CM) was also studied as a second modification to the SCM to include formation of surface precipitates. Both the SPM and the CM were successful in modeling copper uptake and ζ potential variations as a function of pH at various solution conditions and colloid concentrations. From the SPM and CM predictions, it was concluded that for systems with high surface loadings, copper removal from solution occurs due to the formation of both monomeric and dimeric surface complexes, as well as through precipitation mechanisms. [Copyright &y& Elsevier]
	Copyright of Journal of Colloid & Interface Science is the property of Academic Press Inc. and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.)
Database:	Engineering Source

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