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Prediction and Characterization of Dry-out Heat Flux in Micropillar Wick Structures.

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Title: Prediction and Characterization of Dry-out Heat Flux in Micropillar Wick Structures.
Authors: Yangying Zhu1, Antao, Dion S.1, Zhengmao Lu1, Somasundaram, Sivanand2, Tiejun Zhang3, Wang, Evelyn N.1 enwang@mit.edu
Source: Langmuir. Dec2015, Vol. 31 Issue 51, p1920-1927. 8p.
Subjects: Performance of electronics, Prediction models, Heat flux, Molecular structure, Thin films, Evaporation (Chemistry), Cooling
Abstract: Thin-film evaporation in wick structures for cooling high-performance electronic devices is attractive because it harnesses the latent heat of vaporization and does not require external pumping. However, optimizing the wick structures to increase the dry-out heat flux is challenging due to the complexities in modeling the liquid-vapor interface and the flow through the wick structures. In this work, we developed a model for thin-film evaporation from micropillar array wick structures and validated the model with experiments. The model numerically simulates liquid velocity, pressure, and meniscus curvature along the wicking direction by conservation of mass, momentum, and energy based on a finite volume approach. Specifically, the three-dimensional meniscus shape, which varies along the wicking direction with the local liquid pressure, is accurately captured by a force balance using the Young-Laplace equation. The dry-out condition is determined when the minimum contact angle on the pillar surface reaches the receding contact angle as the applied heat flux increases. With this model, we predict the dry-out heat flux on various micropillar structure geometries (diameter, pitch, and height) in the length scale range of 1-100 µm and discuss the optimal geometries to maximize the dry-out heat flux. We also performed detailed experiments to validate the model predictions, which show good agreement. This work provides insights into the role of surface structures in thin-film evaporation and offers important design guidelines for enhanced thermal management of high-performance electronic devices. [ABSTRACT FROM AUTHOR]
Copyright of Langmuir is the property of American Chemical Society and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.)
Database: Engineering Source
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Header DbId: egs
DbLabel: Engineering Source
An: 113302844
AccessLevel: 6
PubType: Academic Journal
PubTypeId: academicJournal
PreciseRelevancyScore: 0
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  Data: Prediction and Characterization of Dry-out Heat Flux in Micropillar Wick Structures.
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  Data: <searchLink fieldCode="AR" term="%22Yangying+Zhu%22">Yangying Zhu</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AR" term="%22Antao%2C+Dion+S%2E%22">Antao, Dion S.</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AR" term="%22Zhengmao+Lu%22">Zhengmao Lu</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AR" term="%22Somasundaram%2C+Sivanand%22">Somasundaram, Sivanand</searchLink><relatesTo>2</relatesTo><br /><searchLink fieldCode="AR" term="%22Tiejun+Zhang%22">Tiejun Zhang</searchLink><relatesTo>3</relatesTo><br /><searchLink fieldCode="AR" term="%22Wang%2C+Evelyn+N%2E%22">Wang, Evelyn N.</searchLink><relatesTo>1</relatesTo><i> enwang@mit.edu</i>
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  Data: <searchLink fieldCode="JN" term="%22Langmuir%22">Langmuir</searchLink>. Dec2015, Vol. 31 Issue 51, p1920-1927. 8p.
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  Data: <searchLink fieldCode="DE" term="%22Performance+of+electronics%22">Performance of electronics</searchLink><br /><searchLink fieldCode="DE" term="%22Prediction+models%22">Prediction models</searchLink><br /><searchLink fieldCode="DE" term="%22Heat+flux%22">Heat flux</searchLink><br /><searchLink fieldCode="DE" term="%22Molecular+structure%22">Molecular structure</searchLink><br /><searchLink fieldCode="DE" term="%22Thin+films%22">Thin films</searchLink><br /><searchLink fieldCode="DE" term="%22Evaporation+%28Chemistry%29%22">Evaporation (Chemistry)</searchLink><br /><searchLink fieldCode="DE" term="%22Cooling%22">Cooling</searchLink>
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  Data: Thin-film evaporation in wick structures for cooling high-performance electronic devices is attractive because it harnesses the latent heat of vaporization and does not require external pumping. However, optimizing the wick structures to increase the dry-out heat flux is challenging due to the complexities in modeling the liquid-vapor interface and the flow through the wick structures. In this work, we developed a model for thin-film evaporation from micropillar array wick structures and validated the model with experiments. The model numerically simulates liquid velocity, pressure, and meniscus curvature along the wicking direction by conservation of mass, momentum, and energy based on a finite volume approach. Specifically, the three-dimensional meniscus shape, which varies along the wicking direction with the local liquid pressure, is accurately captured by a force balance using the Young-Laplace equation. The dry-out condition is determined when the minimum contact angle on the pillar surface reaches the receding contact angle as the applied heat flux increases. With this model, we predict the dry-out heat flux on various micropillar structure geometries (diameter, pitch, and height) in the length scale range of 1-100 µm and discuss the optimal geometries to maximize the dry-out heat flux. We also performed detailed experiments to validate the model predictions, which show good agreement. This work provides insights into the role of surface structures in thin-film evaporation and offers important design guidelines for enhanced thermal management of high-performance electronic devices. [ABSTRACT FROM AUTHOR]
– Name: AbstractSuppliedCopyright
  Label:
  Group: Ab
  Data: <i>Copyright of Langmuir is the property of American Chemical Society and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract.</i> (Copyright applies to all Abstracts.)
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RecordInfo BibRecord:
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      – Type: doi
        Value: 10.1021/acs.langmuir.5b04502
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      – Code: eng
        Text: English
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        PageCount: 8
        StartPage: 1920
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      – SubjectFull: Performance of electronics
        Type: general
      – SubjectFull: Prediction models
        Type: general
      – SubjectFull: Heat flux
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      – SubjectFull: Molecular structure
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      – SubjectFull: Thin films
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      – SubjectFull: Evaporation (Chemistry)
        Type: general
      – SubjectFull: Cooling
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      – TitleFull: Prediction and Characterization of Dry-out Heat Flux in Micropillar Wick Structures.
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              Text: Dec2015
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              Y: 2015
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