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Addressing Time-to-Market with Turnkey Measurement and Modeling Systems.

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Bibliographic Details
Title: Addressing Time-to-Market with Turnkey Measurement and Modeling Systems. (cover story)
Authors: Dudkiewicz, Steve1
Source: Microwave Journal. Mar2016, Vol. 59 Issue 3, p30-36. 4p.
Subjects: Turnkey computer systems, Technological innovations, Vector analysis, Metal oxide semiconductors, Computer simulation
Abstract: The article focuses on the development of the turnkey measurement and modeling system. Topics mentioned include the linear compact models, the vector analysis, and the importance of technological innovations. Also mentioned are the metal oxide semiconductor (MOS) technology and the advanced measurement and modeling software (IVCAD) measurement.
Database: Engineering Source
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Header DbId: egs
DbLabel: Engineering Source
An: 113490301
AccessLevel: 6
PubType: Periodical
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  Data: Addressing Time-to-Market with Turnkey Measurement and Modeling Systems. (cover story)
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  Data: <searchLink fieldCode="JN" term="%22Microwave+Journal%22">Microwave Journal</searchLink>. Mar2016, Vol. 59 Issue 3, p30-36. 4p.
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  Data: The article focuses on the development of the turnkey measurement and modeling system. Topics mentioned include the linear compact models, the vector analysis, and the importance of technological innovations. Also mentioned are the metal oxide semiconductor (MOS) technology and the advanced measurement and modeling software (IVCAD) measurement.
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=egs&AN=113490301
RecordInfo BibRecord:
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      – Code: eng
        Text: English
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        PageCount: 4
        StartPage: 30
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      – SubjectFull: Turnkey computer systems
        Type: general
      – SubjectFull: Technological innovations
        Type: general
      – SubjectFull: Vector analysis
        Type: general
      – SubjectFull: Metal oxide semiconductors
        Type: general
      – SubjectFull: Computer simulation
        Type: general
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      – TitleFull: Addressing Time-to-Market with Turnkey Measurement and Modeling Systems.
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              Text: Mar2016
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              Y: 2016
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