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Two-Phase Convective Cooling for Ultrahigh Power Dissipation in Microprocessors.

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Title: Two-Phase Convective Cooling for Ultrahigh Power Dissipation in Microprocessors.
Authors: Kottke, Peter A.1 pk57@mail.gatech.edu, Yun, Thomas M.1 tyun@gatech.edu, Green, Craig E.1 cgreen8@gatech.edu, Joshi, Yogendra K.1 yogendra.joshi@me.gatech.edu, Fedorov, Andrei G.1,2 agf@gatech.edu
Source: Journal of Heat Transfer. Jan2016, Vol. 138 Issue 1, p1-6. 6p.
Subjects: Energy dissipation, Microprocessor performance, Heat flux, Coolants, Thermodynamics, Heat transfer
Abstract: We present results of modeling for the design of microgaps for the removal of high heat fluxes via a strategy of high mass flux, high quality, and two-phase forced convection. Modeling includes (I) thermodynamic analysis to obtain performance trends across a wide range of candidate coolants, (2) evaluation of worst-case pressure drop due to contraction and expansion in inlet/outlet manifolds, and (3) ID reduced-order simulations to obtain realistic estimates of different contributions to the pressure drops. The main result is the identification of a general trend of improved heat transfer performance at higher system pressure. [ABSTRACT FROM AUTHOR]
Copyright of Journal of Heat Transfer is the property of American Society of Mechanical Engineers and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.)
Database: Engineering Source
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DbLabel: Engineering Source
An: 114259989
AccessLevel: 6
PubType: Academic Journal
PubTypeId: academicJournal
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  Data: Two-Phase Convective Cooling for Ultrahigh Power Dissipation in Microprocessors.
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  Data: <searchLink fieldCode="AR" term="%22Kottke%2C+Peter+A%2E%22">Kottke, Peter A.</searchLink><relatesTo>1</relatesTo><i> pk57@mail.gatech.edu</i><br /><searchLink fieldCode="AR" term="%22Yun%2C+Thomas+M%2E%22">Yun, Thomas M.</searchLink><relatesTo>1</relatesTo><i> tyun@gatech.edu</i><br /><searchLink fieldCode="AR" term="%22Green%2C+Craig+E%2E%22">Green, Craig E.</searchLink><relatesTo>1</relatesTo><i> cgreen8@gatech.edu</i><br /><searchLink fieldCode="AR" term="%22Joshi%2C+Yogendra+K%2E%22">Joshi, Yogendra K.</searchLink><relatesTo>1</relatesTo><i> yogendra.joshi@me.gatech.edu</i><br /><searchLink fieldCode="AR" term="%22Fedorov%2C+Andrei+G%2E%22">Fedorov, Andrei G.</searchLink><relatesTo>1,2</relatesTo><i> agf@gatech.edu</i>
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  Data: <searchLink fieldCode="JN" term="%22Journal+of+Heat+Transfer%22">Journal of Heat Transfer</searchLink>. Jan2016, Vol. 138 Issue 1, p1-6. 6p.
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  Data: <searchLink fieldCode="DE" term="%22Energy+dissipation%22">Energy dissipation</searchLink><br /><searchLink fieldCode="DE" term="%22Microprocessor+performance%22">Microprocessor performance</searchLink><br /><searchLink fieldCode="DE" term="%22Heat+flux%22">Heat flux</searchLink><br /><searchLink fieldCode="DE" term="%22Coolants%22">Coolants</searchLink><br /><searchLink fieldCode="DE" term="%22Thermodynamics%22">Thermodynamics</searchLink><br /><searchLink fieldCode="DE" term="%22Heat+transfer%22">Heat transfer</searchLink>
– Name: Abstract
  Label: Abstract
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  Data: We present results of modeling for the design of microgaps for the removal of high heat fluxes via a strategy of high mass flux, high quality, and two-phase forced convection. Modeling includes (I) thermodynamic analysis to obtain performance trends across a wide range of candidate coolants, (2) evaluation of worst-case pressure drop due to contraction and expansion in inlet/outlet manifolds, and (3) ID reduced-order simulations to obtain realistic estimates of different contributions to the pressure drops. The main result is the identification of a general trend of improved heat transfer performance at higher system pressure. [ABSTRACT FROM AUTHOR]
– Name: AbstractSuppliedCopyright
  Label:
  Group: Ab
  Data: <i>Copyright of Journal of Heat Transfer is the property of American Society of Mechanical Engineers and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract.</i> (Copyright applies to all Abstracts.)
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        Value: 10.1115/1.4031111
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      – Code: eng
        Text: English
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        PageCount: 6
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      – SubjectFull: Energy dissipation
        Type: general
      – SubjectFull: Microprocessor performance
        Type: general
      – SubjectFull: Heat flux
        Type: general
      – SubjectFull: Coolants
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      – SubjectFull: Thermodynamics
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      – SubjectFull: Heat transfer
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      – TitleFull: Two-Phase Convective Cooling for Ultrahigh Power Dissipation in Microprocessors.
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            NameFull: Green, Craig E.
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            NameFull: Joshi, Yogendra K.
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            NameFull: Fedorov, Andrei G.
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              Text: Jan2016
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              Y: 2016
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