Timing Challenges for Very Deep Sub-Micron (VDSM) IC.

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Title: Timing Challenges for Very Deep Sub-Micron (VDSM) IC.
Authors: Ichiang Lin, Hannu1, Chen, Chien-In Henry2
Source: VLSI Design. Nov2002, Vol. 15 Issue 3, p557-562. 6p.
Subjects: Integrated circuits, Integrated circuit interconnections, Very large scale circuit integration, Computer engineering
Abstract: Many IC design houses failed to be market leaders because they miss the market window due to timing closure problems. Compared to half-micron designs, the amount of time spent on timing verification has greatly increased. Cell delays can be accurately estimated during logic synthesis. However, interconnect delays are unknown until the wire geometry is defined in physical design. Logic synthesis using the cell library models for interconnect delay estimates may be statistically accurate, but can not predict the delay of individual nets accurately. Delay estimates for individual nets (global nets, long wires, large fan-outs, buses), which matter most for the critical paths can be inaccurate and cause a design failure. Inaccurate timing verification causes silicon failure in shipped products that results in the loss of millions of dollars spent designing a high-performance product and potentially larger costs due to lost market share. Full-chip, sign-off verification with silicon-accuracy will allow these problems to be discovered and fixed before tape-out. [ABSTRACT FROM AUTHOR]
Copyright of VLSI Design is the property of Wiley-Blackwell and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.)
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  Data: Timing Challenges for Very Deep Sub-Micron (VDSM) IC.
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  Data: Many IC design houses failed to be market leaders because they miss the market window due to timing closure problems. Compared to half-micron designs, the amount of time spent on timing verification has greatly increased. Cell delays can be accurately estimated during logic synthesis. However, interconnect delays are unknown until the wire geometry is defined in physical design. Logic synthesis using the cell library models for interconnect delay estimates may be statistically accurate, but can not predict the delay of individual nets accurately. Delay estimates for individual nets (global nets, long wires, large fan-outs, buses), which matter most for the critical paths can be inaccurate and cause a design failure. Inaccurate timing verification causes silicon failure in shipped products that results in the loss of millions of dollars spent designing a high-performance product and potentially larger costs due to lost market share. Full-chip, sign-off verification with silicon-accuracy will allow these problems to be discovered and fixed before tape-out. [ABSTRACT FROM AUTHOR]
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  Data: <i>Copyright of VLSI Design is the property of Wiley-Blackwell and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract.</i> (Copyright applies to all Abstracts.)
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        Value: 10.1080/1065514021000012183
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      – SubjectFull: Very large scale circuit integration
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      – TitleFull: Timing Challenges for Very Deep Sub-Micron (VDSM) IC.
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              Text: Nov2002
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