Enhanced adhesion and thermal stability of Al/Cr film on indium-tin-oxide (ITO)-coated glass.
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| Title: | Enhanced adhesion and thermal stability of Al/Cr film on indium-tin-oxide (ITO)-coated glass. |
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| Authors: | Hsieh, J. H.1 mjhhsieh@ntu.edu.sg, Tzong-Ming Wu2, Tong, J. Z.2, Yang, S.3 |
| Source: | Journal of Adhesion Science & Technology. 12/25/2003, Vol. 17 Issue 15, p2085-2095. 11p. |
| Subjects: | Adhesion, Metallizing, Metal coating, Wire bonding (Electronic packaging), Adsorption (Chemistry), Indium |
| Abstract: | Metallization of indium-tin-oxide (ITO)-coated glass using an Al/Cr composite thin film is a common practice for chip-on-glass packaging. However, the reliability of the Cr/ITO interface is always a problem because of poor adhesion due to the chemical inertness of ITO. In this study, the adhesion strength between a Cr film and ITO coated glass was enhanced by forming an intermediate oxide layer at the interface. To find out the optimal interface condition, various amounts of oxygen were doped at the interface. The results show that the adhesion strength and thermal stability are both enhanced by the interfacial doping of oxygen. This enhancement is found to be related to the flow rate of oxygen and, therefore, to the oxide thickness. Maximum improvement occurs when the flow rate of oxygen is set at 6 sccm during doping, and at this rate the interface oxide thickness also reaches its maximum value. Under this condition, the Cr/ITO interface also shows the best thermal stability. Wire bond testing shows that the wire pull strength is affected by the thickness of Al film. The results of this study show that the Al film should not be thicker than 1 μm. [ABSTRACT FROM AUTHOR] |
| Copyright of Journal of Adhesion Science & Technology is the property of Taylor & Francis Ltd and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.) | |
| Database: | Engineering Source |
| FullText | Links: – Type: pdflink Text: Availability: 0 |
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| Header | DbId: egs DbLabel: Engineering Source An: 11581387 AccessLevel: 6 PubType: Academic Journal PubTypeId: academicJournal PreciseRelevancyScore: 0 |
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| Items | – Name: Title Label: Title Group: Ti Data: Enhanced adhesion and thermal stability of Al/Cr film on indium-tin-oxide (ITO)-coated glass. – Name: Author Label: Authors Group: Au Data: <searchLink fieldCode="AR" term="%22Hsieh%2C+J%2E+H%2E%22">Hsieh, J. H.</searchLink><relatesTo>1</relatesTo><i> mjhhsieh@ntu.edu.sg</i><br /><searchLink fieldCode="AR" term="%22Tzong-Ming+Wu%22">Tzong-Ming Wu</searchLink><relatesTo>2</relatesTo><br /><searchLink fieldCode="AR" term="%22Tong%2C+J%2E+Z%2E%22">Tong, J. Z.</searchLink><relatesTo>2</relatesTo><br /><searchLink fieldCode="AR" term="%22Yang%2C+S%2E%22">Yang, S.</searchLink><relatesTo>3</relatesTo> – Name: TitleSource Label: Source Group: Src Data: <searchLink fieldCode="JN" term="%22Journal+of+Adhesion+Science+%26+Technology%22">Journal of Adhesion Science & Technology</searchLink>. 12/25/2003, Vol. 17 Issue 15, p2085-2095. 11p. – Name: Subject Label: Subjects Group: Su Data: <searchLink fieldCode="DE" term="%22Adhesion%22">Adhesion</searchLink><br /><searchLink fieldCode="DE" term="%22Metallizing%22">Metallizing</searchLink><br /><searchLink fieldCode="DE" term="%22Metal+coating%22">Metal coating</searchLink><br /><searchLink fieldCode="DE" term="%22Wire+bonding+%28Electronic+packaging%29%22">Wire bonding (Electronic packaging)</searchLink><br /><searchLink fieldCode="DE" term="%22Adsorption+%28Chemistry%29%22">Adsorption (Chemistry)</searchLink><br /><searchLink fieldCode="DE" term="%22Indium%22">Indium</searchLink> – Name: Abstract Label: Abstract Group: Ab Data: Metallization of indium-tin-oxide (ITO)-coated glass using an Al/Cr composite thin film is a common practice for chip-on-glass packaging. However, the reliability of the Cr/ITO interface is always a problem because of poor adhesion due to the chemical inertness of ITO. In this study, the adhesion strength between a Cr film and ITO coated glass was enhanced by forming an intermediate oxide layer at the interface. To find out the optimal interface condition, various amounts of oxygen were doped at the interface. The results show that the adhesion strength and thermal stability are both enhanced by the interfacial doping of oxygen. This enhancement is found to be related to the flow rate of oxygen and, therefore, to the oxide thickness. Maximum improvement occurs when the flow rate of oxygen is set at 6 sccm during doping, and at this rate the interface oxide thickness also reaches its maximum value. Under this condition, the Cr/ITO interface also shows the best thermal stability. Wire bond testing shows that the wire pull strength is affected by the thickness of Al film. The results of this study show that the Al film should not be thicker than 1 μm. [ABSTRACT FROM AUTHOR] – Name: AbstractSuppliedCopyright Label: Group: Ab Data: <i>Copyright of Journal of Adhesion Science & Technology is the property of Taylor & Francis Ltd and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract.</i> (Copyright applies to all Abstracts.) |
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| RecordInfo | BibRecord: BibEntity: Identifiers: – Type: doi Value: 10.1163/156856103322584227 Languages: – Code: eng Text: English PhysicalDescription: Pagination: PageCount: 11 StartPage: 2085 Subjects: – SubjectFull: Adhesion Type: general – SubjectFull: Metallizing Type: general – SubjectFull: Metal coating Type: general – SubjectFull: Wire bonding (Electronic packaging) Type: general – SubjectFull: Adsorption (Chemistry) Type: general – SubjectFull: Indium Type: general Titles: – TitleFull: Enhanced adhesion and thermal stability of Al/Cr film on indium-tin-oxide (ITO)-coated glass. Type: main BibRelationships: HasContributorRelationships: – PersonEntity: Name: NameFull: Hsieh, J. H. – PersonEntity: Name: NameFull: Tzong-Ming Wu – PersonEntity: Name: NameFull: Tong, J. Z. – PersonEntity: Name: NameFull: Yang, S. IsPartOfRelationships: – BibEntity: Dates: – D: 25 M: 12 Text: 12/25/2003 Type: published Y: 2003 Identifiers: – Type: issn-print Value: 01694243 Numbering: – Type: volume Value: 17 – Type: issue Value: 15 Titles: – TitleFull: Journal of Adhesion Science & Technology Type: main |
| ResultId | 1 |
