Bibliographic Details
| Title: |
Experimental Reliability Studies and SPICE Simulation for EEPROM at Temperatures up to 450°C. |
| Authors: |
Kelberer, A.1 Andreas.Kelberer@ims.fraunhofer.de, Dreiner, S.1, Grella, K.1, Dittrich, D.1, Kappert, H.1, Vogt, H.1, Paschen, U.1 |
| Source: |
Journal of Microelectronic & Electronic Packaging. 2016 1st Quarter, Vol. 13 Issue 1, p33-37. 5p. |
| Subjects: |
Silicon polymers, Erasable programmable read-only memory, Simulation Program with Integrated Circuit Emphasis, High temperature electronics, Electronic equipment, Reliability in engineering |
| Abstract: |
This article presents reliability studies of single polysilicon electrically erasable programmable read-only memory (EEPROM) cells at temperatures from 50°C to 450°C. The technically challenging measurements at elevated temperatures >250°C have been carried out for accelerated reliability studies. Furthermore, a SPICE macro model has been extended to the wide temperature range to describe the retention and endurance performance of the memory cell and to enable a better insight into the physics involved. [ABSTRACT FROM AUTHOR] |
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| Database: |
Engineering Source |
