View in EDS PDF Full Text

Experimental Reliability Studies and SPICE Simulation for EEPROM at Temperatures up to 450°C.

Saved in:
Bibliographic Details
Title: Experimental Reliability Studies and SPICE Simulation for EEPROM at Temperatures up to 450°C.
Authors: Kelberer, A.1 Andreas.Kelberer@ims.fraunhofer.de, Dreiner, S.1, Grella, K.1, Dittrich, D.1, Kappert, H.1, Vogt, H.1, Paschen, U.1
Source: Journal of Microelectronic & Electronic Packaging. 2016 1st Quarter, Vol. 13 Issue 1, p33-37. 5p.
Subjects: Silicon polymers, Erasable programmable read-only memory, Simulation Program with Integrated Circuit Emphasis, High temperature electronics, Electronic equipment, Reliability in engineering
Abstract: This article presents reliability studies of single polysilicon electrically erasable programmable read-only memory (EEPROM) cells at temperatures from 50°C to 450°C. The technically challenging measurements at elevated temperatures >250°C have been carried out for accelerated reliability studies. Furthermore, a SPICE macro model has been extended to the wide temperature range to describe the retention and endurance performance of the memory cell and to enable a better insight into the physics involved. [ABSTRACT FROM AUTHOR]
Copyright of Journal of Microelectronic & Electronic Packaging is the property of International Microelectronics & Packaging Society and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.)
Database: Engineering Source
FullText Links:
  – Type: pdflink
Text:
  Availability: 0
Header DbId: egs
DbLabel: Engineering Source
An: 118803322
AccessLevel: 6
PubType: Academic Journal
PubTypeId: academicJournal
PreciseRelevancyScore: 0
IllustrationInfo
Items – Name: Title
  Label: Title
  Group: Ti
  Data: Experimental Reliability Studies and SPICE Simulation for EEPROM at Temperatures up to 450°C.
– Name: Author
  Label: Authors
  Group: Au
  Data: <searchLink fieldCode="AR" term="%22Kelberer%2C+A%2E%22">Kelberer, A.</searchLink><relatesTo>1</relatesTo><i> Andreas.Kelberer@ims.fraunhofer.de</i><br /><searchLink fieldCode="AR" term="%22Dreiner%2C+S%2E%22">Dreiner, S.</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AR" term="%22Grella%2C+K%2E%22">Grella, K.</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AR" term="%22Dittrich%2C+D%2E%22">Dittrich, D.</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AR" term="%22Kappert%2C+H%2E%22">Kappert, H.</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AR" term="%22Vogt%2C+H%2E%22">Vogt, H.</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AR" term="%22Paschen%2C+U%2E%22">Paschen, U.</searchLink><relatesTo>1</relatesTo>
– Name: TitleSource
  Label: Source
  Group: Src
  Data: <searchLink fieldCode="JN" term="%22Journal+of+Microelectronic+%26+Electronic+Packaging%22">Journal of Microelectronic & Electronic Packaging</searchLink>. 2016 1st Quarter, Vol. 13 Issue 1, p33-37. 5p.
– Name: Subject
  Label: Subjects
  Group: Su
  Data: <searchLink fieldCode="DE" term="%22Silicon+polymers%22">Silicon polymers</searchLink><br /><searchLink fieldCode="DE" term="%22Erasable+programmable+read-only+memory%22">Erasable programmable read-only memory</searchLink><br /><searchLink fieldCode="DE" term="%22Simulation+Program+with+Integrated+Circuit+Emphasis%22">Simulation Program with Integrated Circuit Emphasis</searchLink><br /><searchLink fieldCode="DE" term="%22High+temperature+electronics%22">High temperature electronics</searchLink><br /><searchLink fieldCode="DE" term="%22Electronic+equipment%22">Electronic equipment</searchLink><br /><searchLink fieldCode="DE" term="%22Reliability+in+engineering%22">Reliability in engineering</searchLink>
– Name: Abstract
  Label: Abstract
  Group: Ab
  Data: This article presents reliability studies of single polysilicon electrically erasable programmable read-only memory (EEPROM) cells at temperatures from 50°C to 450°C. The technically challenging measurements at elevated temperatures >250°C have been carried out for accelerated reliability studies. Furthermore, a SPICE macro model has been extended to the wide temperature range to describe the retention and endurance performance of the memory cell and to enable a better insight into the physics involved. [ABSTRACT FROM AUTHOR]
– Name: AbstractSuppliedCopyright
  Label:
  Group: Ab
  Data: <i>Copyright of Journal of Microelectronic & Electronic Packaging is the property of International Microelectronics & Packaging Society and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract.</i> (Copyright applies to all Abstracts.)
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=egs&AN=118803322
RecordInfo BibRecord:
  BibEntity:
    Identifiers:
      – Type: doi
        Value: 10.4071/imaps.487
    Languages:
      – Code: eng
        Text: English
    PhysicalDescription:
      Pagination:
        PageCount: 5
        StartPage: 33
    Subjects:
      – SubjectFull: Silicon polymers
        Type: general
      – SubjectFull: Erasable programmable read-only memory
        Type: general
      – SubjectFull: Simulation Program with Integrated Circuit Emphasis
        Type: general
      – SubjectFull: High temperature electronics
        Type: general
      – SubjectFull: Electronic equipment
        Type: general
      – SubjectFull: Reliability in engineering
        Type: general
    Titles:
      – TitleFull: Experimental Reliability Studies and SPICE Simulation for EEPROM at Temperatures up to 450°C.
        Type: main
  BibRelationships:
    HasContributorRelationships:
      – PersonEntity:
          Name:
            NameFull: Kelberer, A.
      – PersonEntity:
          Name:
            NameFull: Dreiner, S.
      – PersonEntity:
          Name:
            NameFull: Grella, K.
      – PersonEntity:
          Name:
            NameFull: Dittrich, D.
      – PersonEntity:
          Name:
            NameFull: Kappert, H.
      – PersonEntity:
          Name:
            NameFull: Vogt, H.
      – PersonEntity:
          Name:
            NameFull: Paschen, U.
    IsPartOfRelationships:
      – BibEntity:
          Dates:
            – D: 01
              M: 01
              Text: 2016 1st Quarter
              Type: published
              Y: 2016
          Identifiers:
            – Type: issn-print
              Value: 15514897
          Numbering:
            – Type: volume
              Value: 13
            – Type: issue
              Value: 1
          Titles:
            – TitleFull: Journal of Microelectronic & Electronic Packaging
              Type: main
ResultId 1