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Particle Free Handling of Substrates.

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Title: Particle Free Handling of Substrates.
Authors: Samadi, Hassan1, Pfeffer, Markus1, Altmann, Roswitha1, Leibold, Andreas1, Gumprecht, Thomas1, Bauer, Anton1
Source: IEEE Transactions on Semiconductor Manufacturing. Nov2016, Vol. 29 Issue 4, p314-319. 6p.
Subjects: Semiconductor technology, Lithography techniques, Assembly line methods, Materials handling, Semiconductor wafers, Integrated circuits
Abstract: Semiconductor technology is heading toward the 10 nm node and even smaller in the coming years. This development relies not only on new process technologies, like lithography techniques, but also on safer and cleaner handling techniques that meet the high-end requirements of the production line. In this paper, the evaluation of different end-effectors and handling techniques regarding particle generation, organic, and metallic contamination effects will be discussed. Bernoulli, ultrasonic, carbon, and standard vacuum end-effectors are being tested and compared with each other for the handling of 300 mm wafers. [ABSTRACT FROM AUTHOR]
Copyright of IEEE Transactions on Semiconductor Manufacturing is the property of IEEE and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.)
Database: Engineering Source
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DbLabel: Engineering Source
An: 119240839
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PubType: Academic Journal
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  Data: <searchLink fieldCode="DE" term="%22Semiconductor+technology%22">Semiconductor technology</searchLink><br /><searchLink fieldCode="DE" term="%22Lithography+techniques%22">Lithography techniques</searchLink><br /><searchLink fieldCode="DE" term="%22Assembly+line+methods%22">Assembly line methods</searchLink><br /><searchLink fieldCode="DE" term="%22Materials+handling%22">Materials handling</searchLink><br /><searchLink fieldCode="DE" term="%22Semiconductor+wafers%22">Semiconductor wafers</searchLink><br /><searchLink fieldCode="DE" term="%22Integrated+circuits%22">Integrated circuits</searchLink>
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  Data: Semiconductor technology is heading toward the 10 nm node and even smaller in the coming years. This development relies not only on new process technologies, like lithography techniques, but also on safer and cleaner handling techniques that meet the high-end requirements of the production line. In this paper, the evaluation of different end-effectors and handling techniques regarding particle generation, organic, and metallic contamination effects will be discussed. Bernoulli, ultrasonic, carbon, and standard vacuum end-effectors are being tested and compared with each other for the handling of 300 mm wafers. [ABSTRACT FROM AUTHOR]
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  Data: <i>Copyright of IEEE Transactions on Semiconductor Manufacturing is the property of IEEE and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract.</i> (Copyright applies to all Abstracts.)
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        Value: 10.1109/TSM.2016.2596980
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        Text: English
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