Heat Flow Pattern and Thermal Resistance Modeling of Anisotropic Heat Spreaders.
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| Title: | Heat Flow Pattern and Thermal Resistance Modeling of Anisotropic Heat Spreaders. |
|---|---|
| Authors: | Falakzaadeh, F.1, Mehryar, R.1 Mehryar@sutech.ac.ir |
| Source: | Journal of Electronic Materials. Jan2017, Vol. 46 Issue 1, p64-72. 9p. |
| Subjects: | Heat equation, Electronics packaging, Isotropic properties, Thermal resistance, Anisotropy |
| Abstract: | To ensure safe operating temperatures of the ever smaller heat generating electronic devices, drastic measures should be taken. Heat spreaders are used to increase surface area, by spreading the heat without necessarily transferring it to the ambient in the first place. The heat flow pattern is investigated in heat spreaders and the fundamental differences regarding how heat conducts in different materials is addressed. Isotropic materials are compared with anisotropic ones having a specifically higher in-plane thermal conductivity than through plane direction. Thermal resistance models are proposed for anisotropic and isotropic heat spreaders in compliance with the order of magnitude of dimensions used in electronics packaging. After establishing thermal resistance models for both the isotropic and anisotropic cases, numerical results are used to find a correlation for predicting thermal resistance in anisotropic heat spreaders with high anisotropy ratios. [ABSTRACT FROM AUTHOR] |
| Copyright of Journal of Electronic Materials is the property of Springer Nature and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.) | |
| Database: | Engineering Source |
| FullText | Links: – Type: pdflink Text: Availability: 0 |
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| Header | DbId: egs DbLabel: Engineering Source An: 120384714 AccessLevel: 6 PubType: Academic Journal PubTypeId: academicJournal PreciseRelevancyScore: 0 |
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| Items | – Name: Title Label: Title Group: Ti Data: Heat Flow Pattern and Thermal Resistance Modeling of Anisotropic Heat Spreaders. – Name: Author Label: Authors Group: Au Data: <searchLink fieldCode="AR" term="%22Falakzaadeh%2C+F%2E%22">Falakzaadeh, F.</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AR" term="%22Mehryar%2C+R%2E%22">Mehryar, R.</searchLink><relatesTo>1</relatesTo><i> Mehryar@sutech.ac.ir</i> – Name: TitleSource Label: Source Group: Src Data: <searchLink fieldCode="JN" term="%22Journal+of+Electronic+Materials%22">Journal of Electronic Materials</searchLink>. Jan2017, Vol. 46 Issue 1, p64-72. 9p. – Name: Subject Label: Subjects Group: Su Data: <searchLink fieldCode="DE" term="%22Heat+equation%22">Heat equation</searchLink><br /><searchLink fieldCode="DE" term="%22Electronics+packaging%22">Electronics packaging</searchLink><br /><searchLink fieldCode="DE" term="%22Isotropic+properties%22">Isotropic properties</searchLink><br /><searchLink fieldCode="DE" term="%22Thermal+resistance%22">Thermal resistance</searchLink><br /><searchLink fieldCode="DE" term="%22Anisotropy%22">Anisotropy</searchLink> – Name: Abstract Label: Abstract Group: Ab Data: To ensure safe operating temperatures of the ever smaller heat generating electronic devices, drastic measures should be taken. Heat spreaders are used to increase surface area, by spreading the heat without necessarily transferring it to the ambient in the first place. The heat flow pattern is investigated in heat spreaders and the fundamental differences regarding how heat conducts in different materials is addressed. Isotropic materials are compared with anisotropic ones having a specifically higher in-plane thermal conductivity than through plane direction. Thermal resistance models are proposed for anisotropic and isotropic heat spreaders in compliance with the order of magnitude of dimensions used in electronics packaging. After establishing thermal resistance models for both the isotropic and anisotropic cases, numerical results are used to find a correlation for predicting thermal resistance in anisotropic heat spreaders with high anisotropy ratios. [ABSTRACT FROM AUTHOR] – Name: AbstractSuppliedCopyright Label: Group: Ab Data: <i>Copyright of Journal of Electronic Materials is the property of Springer Nature and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract.</i> (Copyright applies to all Abstracts.) |
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| RecordInfo | BibRecord: BibEntity: Identifiers: – Type: doi Value: 10.1007/s11664-016-4854-1 Languages: – Code: eng Text: English PhysicalDescription: Pagination: PageCount: 9 StartPage: 64 Subjects: – SubjectFull: Heat equation Type: general – SubjectFull: Electronics packaging Type: general – SubjectFull: Isotropic properties Type: general – SubjectFull: Thermal resistance Type: general – SubjectFull: Anisotropy Type: general Titles: – TitleFull: Heat Flow Pattern and Thermal Resistance Modeling of Anisotropic Heat Spreaders. Type: main BibRelationships: HasContributorRelationships: – PersonEntity: Name: NameFull: Falakzaadeh, F. – PersonEntity: Name: NameFull: Mehryar, R. IsPartOfRelationships: – BibEntity: Dates: – D: 01 M: 01 Text: Jan2017 Type: published Y: 2017 Identifiers: – Type: issn-print Value: 03615235 Numbering: – Type: volume Value: 46 – Type: issue Value: 1 Titles: – TitleFull: Journal of Electronic Materials Type: main |
| ResultId | 1 |
