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Development of hot embossing stamps with conformal cooling channels for microreplication.

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Title: Development of hot embossing stamps with conformal cooling channels for microreplication.
Authors: Kuo, Chil-Chyuan1 jacksonk@mail.mcut.edu.tw, Chen, Bing-Cheng1
Source: International Journal of Advanced Manufacturing Technology. Feb2017, Vol. 88 Issue 9-12, p2603-2608. 6p. 2 Color Photographs, 3 Diagrams, 1 Graph.
Subjects: Embossing (Metalwork), Aluminum, Epoxy resins, Cooling, Thermal conductivity
Abstract: Hot embossing stamp fabricated from aluminum-filled epoxy resin can be employed for short-run productions. However, the cooling time is much longer compared to metallic stamps due to poorer thermal conductivity. Therefore, developing a hot embossing stamp with high cooling efficiency is an important issue. In this study, three different cooling-channel layouts were employed to fabricate hot embossing stamps using rapid prototyping and rapid tooling techniques. Effects of different hot embossing stamps on the cooling time during hot embossing molding were investigated. It was found that the reduction in cooling time about 92 % can be obtained when a hot embossing stamp with conformal cooling channels compared to the hot embossing stamp without cooling channels. The manufacturing cost reduction for a micro-featured hot embossing stamp with high cooling efficiency about 72 % can be obtained using the method proposed in this work. [ABSTRACT FROM AUTHOR]
Copyright of International Journal of Advanced Manufacturing Technology is the property of Springer Nature and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.)
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  Data: Development of hot embossing stamps with conformal cooling channels for microreplication.
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  Data: <searchLink fieldCode="AR" term="%22Kuo%2C+Chil-Chyuan%22">Kuo, Chil-Chyuan</searchLink><relatesTo>1</relatesTo><i> jacksonk@mail.mcut.edu.tw</i><br /><searchLink fieldCode="AR" term="%22Chen%2C+Bing-Cheng%22">Chen, Bing-Cheng</searchLink><relatesTo>1</relatesTo>
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  Data: <searchLink fieldCode="JN" term="%22International+Journal+of+Advanced+Manufacturing+Technology%22">International Journal of Advanced Manufacturing Technology</searchLink>. Feb2017, Vol. 88 Issue 9-12, p2603-2608. 6p. 2 Color Photographs, 3 Diagrams, 1 Graph.
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  Data: <searchLink fieldCode="DE" term="%22Embossing+%28Metalwork%29%22">Embossing (Metalwork)</searchLink><br /><searchLink fieldCode="DE" term="%22Aluminum%22">Aluminum</searchLink><br /><searchLink fieldCode="DE" term="%22Epoxy+resins%22">Epoxy resins</searchLink><br /><searchLink fieldCode="DE" term="%22Cooling%22">Cooling</searchLink><br /><searchLink fieldCode="DE" term="%22Thermal+conductivity%22">Thermal conductivity</searchLink>
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  Label: Abstract
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  Data: Hot embossing stamp fabricated from aluminum-filled epoxy resin can be employed for short-run productions. However, the cooling time is much longer compared to metallic stamps due to poorer thermal conductivity. Therefore, developing a hot embossing stamp with high cooling efficiency is an important issue. In this study, three different cooling-channel layouts were employed to fabricate hot embossing stamps using rapid prototyping and rapid tooling techniques. Effects of different hot embossing stamps on the cooling time during hot embossing molding were investigated. It was found that the reduction in cooling time about 92 % can be obtained when a hot embossing stamp with conformal cooling channels compared to the hot embossing stamp without cooling channels. The manufacturing cost reduction for a micro-featured hot embossing stamp with high cooling efficiency about 72 % can be obtained using the method proposed in this work. [ABSTRACT FROM AUTHOR]
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  Data: <i>Copyright of International Journal of Advanced Manufacturing Technology is the property of Springer Nature and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract.</i> (Copyright applies to all Abstracts.)
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        Value: 10.1007/s00170-016-8970-0
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        Text: English
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        Type: general
      – SubjectFull: Aluminum
        Type: general
      – SubjectFull: Epoxy resins
        Type: general
      – SubjectFull: Cooling
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      – SubjectFull: Thermal conductivity
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              Text: Feb2017
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              Y: 2017
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