Development of low-cost hot embossing stamps with long life span and environmental protection.

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Bibliographic Details
Title:	Development of low-cost hot embossing stamps with long life span and environmental protection.
Authors:	Kuo, Chil-Chyuan¹ jacksonk@mail.mcut.edu.tw, Lyu, Shin-Yun¹
Source:	International Journal of Advanced Manufacturing Technology. Jul2017, Vol. 91 Issue 5-8, p1889-1895. 7p. 6 Color Photographs, 1 Black and White Photograph, 2 Diagrams, 3 Graphs.
Subjects:	Embossing (Metalwork), Fabrication (Manufacturing), Manufacturing processes, Optical elements, Optics
Abstract:	Time, cost, and life span are three major concerns that are needed to manufacture a new hot embossing stamp in the industry. The aim of this study is to develop a rapid and low-cost method for fabricating new hot embossing stamps with a long life span. Based on the results of ANSYS simulations, the maximum stresses can be reduced when the round and chamfer were applied at the junction of groove and sprue in the backing plate. Experimental results found that the fracture locations were found to be in reasonable agreement with the simulation results using ANSYS software. The hot embossing stamp can be used for batch production and evaluation in the research and development stage of a new optical element when the junction of groove and sprue in the backing plate were rounded with a radius more than 2 mm or chamfered with a width more than 3 mm. [ABSTRACT FROM AUTHOR]
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Database:	Engineering Source

Description
Abstract:	Time, cost, and life span are three major concerns that are needed to manufacture a new hot embossing stamp in the industry. The aim of this study is to develop a rapid and low-cost method for fabricating new hot embossing stamps with a long life span. Based on the results of ANSYS simulations, the maximum stresses can be reduced when the round and chamfer were applied at the junction of groove and sprue in the backing plate. Experimental results found that the fracture locations were found to be in reasonable agreement with the simulation results using ANSYS software. The hot embossing stamp can be used for batch production and evaluation in the research and development stage of a new optical element when the junction of groove and sprue in the backing plate were rounded with a radius more than 2 mm or chamfered with a width more than 3 mm. [ABSTRACT FROM AUTHOR]
ISSN:	02683768
DOI:	10.1007/s00170-016-9953-x