View in EDS PDF Full Text

Development of low-cost hot embossing stamps with long life span and environmental protection.

Saved in:
Bibliographic Details
Title: Development of low-cost hot embossing stamps with long life span and environmental protection.
Authors: Kuo, Chil-Chyuan1 jacksonk@mail.mcut.edu.tw, Lyu, Shin-Yun1
Source: International Journal of Advanced Manufacturing Technology. Jul2017, Vol. 91 Issue 5-8, p1889-1895. 7p. 6 Color Photographs, 1 Black and White Photograph, 2 Diagrams, 3 Graphs.
Subjects: Embossing (Metalwork), Fabrication (Manufacturing), Manufacturing processes, Optical elements, Optics
Abstract: Time, cost, and life span are three major concerns that are needed to manufacture a new hot embossing stamp in the industry. The aim of this study is to develop a rapid and low-cost method for fabricating new hot embossing stamps with a long life span. Based on the results of ANSYS simulations, the maximum stresses can be reduced when the round and chamfer were applied at the junction of groove and sprue in the backing plate. Experimental results found that the fracture locations were found to be in reasonable agreement with the simulation results using ANSYS software. The hot embossing stamp can be used for batch production and evaluation in the research and development stage of a new optical element when the junction of groove and sprue in the backing plate were rounded with a radius more than 2 mm or chamfered with a width more than 3 mm. [ABSTRACT FROM AUTHOR]
Copyright of International Journal of Advanced Manufacturing Technology is the property of Springer Nature and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.)
Database: Engineering Source
FullText Links:
  – Type: pdflink
Text:
  Availability: 0
Header DbId: egs
DbLabel: Engineering Source
An: 123773580
AccessLevel: 6
PubType: Academic Journal
PubTypeId: academicJournal
PreciseRelevancyScore: 0
IllustrationInfo
Items – Name: Title
  Label: Title
  Group: Ti
  Data: Development of low-cost hot embossing stamps with long life span and environmental protection.
– Name: Author
  Label: Authors
  Group: Au
  Data: <searchLink fieldCode="AR" term="%22Kuo%2C+Chil-Chyuan%22">Kuo, Chil-Chyuan</searchLink><relatesTo>1</relatesTo><i> jacksonk@mail.mcut.edu.tw</i><br /><searchLink fieldCode="AR" term="%22Lyu%2C+Shin-Yun%22">Lyu, Shin-Yun</searchLink><relatesTo>1</relatesTo>
– Name: TitleSource
  Label: Source
  Group: Src
  Data: <searchLink fieldCode="JN" term="%22International+Journal+of+Advanced+Manufacturing+Technology%22">International Journal of Advanced Manufacturing Technology</searchLink>. Jul2017, Vol. 91 Issue 5-8, p1889-1895. 7p. 6 Color Photographs, 1 Black and White Photograph, 2 Diagrams, 3 Graphs.
– Name: Subject
  Label: Subjects
  Group: Su
  Data: <searchLink fieldCode="DE" term="%22Embossing+%28Metalwork%29%22">Embossing (Metalwork)</searchLink><br /><searchLink fieldCode="DE" term="%22Fabrication+%28Manufacturing%29%22">Fabrication (Manufacturing)</searchLink><br /><searchLink fieldCode="DE" term="%22Manufacturing+processes%22">Manufacturing processes</searchLink><br /><searchLink fieldCode="DE" term="%22Optical+elements%22">Optical elements</searchLink><br /><searchLink fieldCode="DE" term="%22Optics%22">Optics</searchLink>
– Name: Abstract
  Label: Abstract
  Group: Ab
  Data: Time, cost, and life span are three major concerns that are needed to manufacture a new hot embossing stamp in the industry. The aim of this study is to develop a rapid and low-cost method for fabricating new hot embossing stamps with a long life span. Based on the results of ANSYS simulations, the maximum stresses can be reduced when the round and chamfer were applied at the junction of groove and sprue in the backing plate. Experimental results found that the fracture locations were found to be in reasonable agreement with the simulation results using ANSYS software. The hot embossing stamp can be used for batch production and evaluation in the research and development stage of a new optical element when the junction of groove and sprue in the backing plate were rounded with a radius more than 2 mm or chamfered with a width more than 3 mm. [ABSTRACT FROM AUTHOR]
– Name: AbstractSuppliedCopyright
  Label:
  Group: Ab
  Data: <i>Copyright of International Journal of Advanced Manufacturing Technology is the property of Springer Nature and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract.</i> (Copyright applies to all Abstracts.)
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=egs&AN=123773580
RecordInfo BibRecord:
  BibEntity:
    Identifiers:
      – Type: doi
        Value: 10.1007/s00170-016-9953-x
    Languages:
      – Code: eng
        Text: English
    PhysicalDescription:
      Pagination:
        PageCount: 7
        StartPage: 1889
    Subjects:
      – SubjectFull: Embossing (Metalwork)
        Type: general
      – SubjectFull: Fabrication (Manufacturing)
        Type: general
      – SubjectFull: Manufacturing processes
        Type: general
      – SubjectFull: Optical elements
        Type: general
      – SubjectFull: Optics
        Type: general
    Titles:
      – TitleFull: Development of low-cost hot embossing stamps with long life span and environmental protection.
        Type: main
  BibRelationships:
    HasContributorRelationships:
      – PersonEntity:
          Name:
            NameFull: Kuo, Chil-Chyuan
      – PersonEntity:
          Name:
            NameFull: Lyu, Shin-Yun
    IsPartOfRelationships:
      – BibEntity:
          Dates:
            – D: 15
              M: 07
              Text: Jul2017
              Type: published
              Y: 2017
          Identifiers:
            – Type: issn-print
              Value: 02683768
          Numbering:
            – Type: volume
              Value: 91
            – Type: issue
              Value: 5-8
          Titles:
            – TitleFull: International Journal of Advanced Manufacturing Technology
              Type: main
ResultId 1