APA (7th ed.) Citation

Iliescu, C., Jianmin Miao, C., & Avram, M. (2003). FABRICATION OF CHIP SCALE PIEZORESISTIVE PRESSURE SENSORS USING SCREEN-PRINTED GLASS FRIT PACKAGING. International Journal of Computational Engineering Science, 4(2), 343. https://doi.org/10.1142/S146587630300123X

Chicago Style (17th ed.) Citation

Iliescu, Ciprian, Ciprian Jianmin Miao, and Marioara Avram. "FABRICATION OF CHIP SCALE PIEZORESISTIVE PRESSURE SENSORS USING SCREEN-PRINTED GLASS FRIT PACKAGING." International Journal of Computational Engineering Science 4, no. 2 (2003): 343. https://doi.org/10.1142/S146587630300123X.

MLA (9th ed.) Citation

Iliescu, Ciprian, et al. "FABRICATION OF CHIP SCALE PIEZORESISTIVE PRESSURE SENSORS USING SCREEN-PRINTED GLASS FRIT PACKAGING." International Journal of Computational Engineering Science, vol. 4, no. 2, 2003, p. 343, https://doi.org/10.1142/S146587630300123X.