FABRICATION OF CHIP SCALE PIEZORESISTIVE PRESSURE SENSORS USING SCREEN-PRINTED GLASS FRIT PACKAGING.
Saved in:
| Title: | FABRICATION OF CHIP SCALE PIEZORESISTIVE PRESSURE SENSORS USING SCREEN-PRINTED GLASS FRIT PACKAGING. |
|---|---|
| Authors: | Iliescu, Ciprian1, Jianmin Miao, Ciprian2, Avram, Marioara3 |
| Source: | International Journal of Computational Engineering Science. Jun2003, Vol. 4 Issue 2, p343-346. 4p. |
| Subjects: | Pressure transducers, Chip scale packaging, Screen process printing, Microelectromechanical systems, Plastic embedment of electronic equipment, Residual stresses |
| Abstract: | This paper presents the chip scale packaging of pressure sensors using glass frit technology. The silicon wafer of pressure sensors is sandwiched between the anodically bonded bottom glass wafer with an etched hole, and the glass-frit bonded top glass wafer with the solder bumps. The screen-printed glass frit technique can overcome the planarization problem associated with metallization of the piezoresistors on the silicon wafers. The diffused piezoresistive Wheastone bridge is fabricated on the diaphragm enabling to measure the pressure range between 0 to 0.4 bars. At the same time the tensometric piezoresistive bridge is integrated to monitor the residual stress induced by this packaging technique. [ABSTRACT FROM AUTHOR] |
| Copyright of International Journal of Computational Engineering Science is the property of World Scientific Publishing Company and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.) | |
| Database: | Engineering Source |
| FullText | Links: – Type: pdflink Text: Availability: 0 |
|---|---|
| Header | DbId: egs DbLabel: Engineering Source An: 12407608 AccessLevel: 6 PubType: Academic Journal PubTypeId: academicJournal PreciseRelevancyScore: 0 |
| IllustrationInfo | |
| Items | – Name: Title Label: Title Group: Ti Data: FABRICATION OF CHIP SCALE PIEZORESISTIVE PRESSURE SENSORS USING SCREEN-PRINTED GLASS FRIT PACKAGING. – Name: Author Label: Authors Group: Au Data: <searchLink fieldCode="AR" term="%22Iliescu%2C+Ciprian%22">Iliescu, Ciprian</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AR" term="%22Jianmin+Miao%2C+Ciprian%22">Jianmin Miao, Ciprian</searchLink><relatesTo>2</relatesTo><br /><searchLink fieldCode="AR" term="%22Avram%2C+Marioara%22">Avram, Marioara</searchLink><relatesTo>3</relatesTo> – Name: TitleSource Label: Source Group: Src Data: <searchLink fieldCode="JN" term="%22International+Journal+of+Computational+Engineering+Science%22">International Journal of Computational Engineering Science</searchLink>. Jun2003, Vol. 4 Issue 2, p343-346. 4p. – Name: Subject Label: Subjects Group: Su Data: <searchLink fieldCode="DE" term="%22Pressure+transducers%22">Pressure transducers</searchLink><br /><searchLink fieldCode="DE" term="%22Chip+scale+packaging%22">Chip scale packaging</searchLink><br /><searchLink fieldCode="DE" term="%22Screen+process+printing%22">Screen process printing</searchLink><br /><searchLink fieldCode="DE" term="%22Microelectromechanical+systems%22">Microelectromechanical systems</searchLink><br /><searchLink fieldCode="DE" term="%22Plastic+embedment+of+electronic+equipment%22">Plastic embedment of electronic equipment</searchLink><br /><searchLink fieldCode="DE" term="%22Residual+stresses%22">Residual stresses</searchLink> – Name: Abstract Label: Abstract Group: Ab Data: This paper presents the chip scale packaging of pressure sensors using glass frit technology. The silicon wafer of pressure sensors is sandwiched between the anodically bonded bottom glass wafer with an etched hole, and the glass-frit bonded top glass wafer with the solder bumps. The screen-printed glass frit technique can overcome the planarization problem associated with metallization of the piezoresistors on the silicon wafers. The diffused piezoresistive Wheastone bridge is fabricated on the diaphragm enabling to measure the pressure range between 0 to 0.4 bars. At the same time the tensometric piezoresistive bridge is integrated to monitor the residual stress induced by this packaging technique. [ABSTRACT FROM AUTHOR] – Name: AbstractSuppliedCopyright Label: Group: Ab Data: <i>Copyright of International Journal of Computational Engineering Science is the property of World Scientific Publishing Company and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract.</i> (Copyright applies to all Abstracts.) |
| PLink | https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=egs&AN=12407608 |
| RecordInfo | BibRecord: BibEntity: Identifiers: – Type: doi Value: 10.1142/S146587630300123X Languages: – Code: eng Text: English PhysicalDescription: Pagination: PageCount: 4 StartPage: 343 Subjects: – SubjectFull: Pressure transducers Type: general – SubjectFull: Chip scale packaging Type: general – SubjectFull: Screen process printing Type: general – SubjectFull: Microelectromechanical systems Type: general – SubjectFull: Plastic embedment of electronic equipment Type: general – SubjectFull: Residual stresses Type: general Titles: – TitleFull: FABRICATION OF CHIP SCALE PIEZORESISTIVE PRESSURE SENSORS USING SCREEN-PRINTED GLASS FRIT PACKAGING. Type: main BibRelationships: HasContributorRelationships: – PersonEntity: Name: NameFull: Iliescu, Ciprian – PersonEntity: Name: NameFull: Jianmin Miao, Ciprian – PersonEntity: Name: NameFull: Avram, Marioara IsPartOfRelationships: – BibEntity: Dates: – D: 01 M: 06 Text: Jun2003 Type: published Y: 2003 Identifiers: – Type: issn-print Value: 14658763 Numbering: – Type: volume Value: 4 – Type: issue Value: 2 Titles: – TitleFull: International Journal of Computational Engineering Science Type: main |
| ResultId | 1 |
