APA (7th ed.) Citation

Xiao, Z., Yao, M., Yu, D., Zhou, M., Dai, F., Fan, J., . . . Zhang, W. (2017). Development and reliability study of 3D WLCSP for CMOS image sensor using vertical TSVs with 3: 1 aspect ratio. Microsystem Technologies, 23(10), 4879. https://doi.org/10.1007/s00542-016-3267-7

Chicago Style (17th ed.) Citation

Xiao, Zhiyi, Mingjun Yao, Daquan Yu, Minghao Zhou, Fengwei Dai, Jun Fan, Min Xiang, and Wei Zhang. "Development and Reliability Study of 3D WLCSP for CMOS Image Sensor Using Vertical TSVs with 3: 1 Aspect Ratio." Microsystem Technologies 23, no. 10 (2017): 4879. https://doi.org/10.1007/s00542-016-3267-7.

MLA (9th ed.) Citation

Xiao, Zhiyi, et al. "Development and Reliability Study of 3D WLCSP for CMOS Image Sensor Using Vertical TSVs with 3: 1 Aspect Ratio." Microsystem Technologies, vol. 23, no. 10, 2017, p. 4879, https://doi.org/10.1007/s00542-016-3267-7.