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Present and future thermal interface materials for electronic devices.

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Title: Present and future thermal interface materials for electronic devices.
Authors: Razeeb, Kafil M.1, Dalton, Eric2, Cross, Graham Lawerence William3, Robinson, Anthony James4,5
Source: International Materials Reviews. Jan2018, Vol. 63 Issue 1, p1-21. 21p.
Subjects: Thermal interface materials, Electronics packaging, Integrated circuits, Heat sinks (Electronics), Thermal resistance
Abstract: Packaging electronic devices is a growing challenge as device performance and power levels escalate. As device feature sizes decrease, ensuring reliable operation becomes a challenge. Ensuring effective heat transfer from an integrated circuit and its heat spreader to a heat sink is a vital step in meeting this challenge. The projected power density and junction-to-ambient thermal resistance for high-performance chips at the 14 nm generation are >100 Wcm−2and <0.2 °CW−1, respectively. The main bottleneck in reducing the net thermal resistance are the thermal resistances of the thermal interface material (TIM). This review evaluates the current state of the art of TIMs. Here, the theory of thermal surface interaction will be addressed and the practicalities of the measurement techniques and the reliability of TIMs will be discussed. Furthermore, the next generation of TIMs will be discussed in terms of potential thermal solutions in the realisation of Internet of Things. [ABSTRACT FROM AUTHOR]
Copyright of International Materials Reviews is the property of Sage Publications Inc. and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.)
Database: Engineering Source
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PubType: Academic Journal
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  Data: Packaging electronic devices is a growing challenge as device performance and power levels escalate. As device feature sizes decrease, ensuring reliable operation becomes a challenge. Ensuring effective heat transfer from an integrated circuit and its heat spreader to a heat sink is a vital step in meeting this challenge. The projected power density and junction-to-ambient thermal resistance for high-performance chips at the 14 nm generation are &gt;100 Wcm−2and &lt;0.2 &#176;CW−1, respectively. The main bottleneck in reducing the net thermal resistance are the thermal resistances of the thermal interface material (TIM). This review evaluates the current state of the art of TIMs. Here, the theory of thermal surface interaction will be addressed and the practicalities of the measurement techniques and the reliability of TIMs will be discussed. Furthermore, the next generation of TIMs will be discussed in terms of potential thermal solutions in the realisation of Internet of Things. [ABSTRACT FROM AUTHOR]
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  Data: &lt;i&gt;Copyright of International Materials Reviews is the property of Sage Publications Inc. and its content may not be copied or emailed to multiple sites without the copyright holder&#39;s express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract.&lt;/i&gt; (Copyright applies to all Abstracts.)
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        Value: 10.1080/09506608.2017.1296605
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        Text: English
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        Type: general
      – SubjectFull: Electronics packaging
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      – SubjectFull: Integrated circuits
        Type: general
      – SubjectFull: Heat sinks (Electronics)
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      – SubjectFull: Thermal resistance
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      – TitleFull: Present and future thermal interface materials for electronic devices.
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              Text: Jan2018
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