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Overdriving reliability of chip scale packaged LEDs: Quantitatively analyzing the impact of component.

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Title: Overdriving reliability of chip scale packaged LEDs: Quantitatively analyzing the impact of component.
Authors: Tang, Hongyu1,2, Ye, Huaiyu3,4 h.ye@tudelft.nl, Wong, Cell K.Y.2,5, Leung, Stanely Y.Y.2,5, Fan, Jiajie2,6, Chen, Xianping3,4, Fan, Xuejun7, Zhang, Guoqi1,5 G.Q.Zhang@tudelft.nl
Source: Microelectronics Reliability. Nov2017, Vol. 78, p197-204. 8p.
Subjects: Light emitting diodes, Chip scale packaging, Quantitative chemical analysis, Electronic color sensors, Dimensional preference
Abstract: The objective of this study is to quantitatively evaluate the impacts of LED components on the overdriving reliability of high power white LED chip scale packages (CSPs). The reliability tests under room temperature are conducted over 1000 h in this study on CSP LEDs with overdriving currents. A novel method is proposed to investigate the impact of various components, including blue die, phosphor layer, and substrate, on the lumen depreciation of CSP LEDs after aging test. The electro-optical measurement results show that the overdriving current can lead to both massive light output degradation and significant color shift of CSP LEDs. The quantitative analysis results show that the phosphor layer is the major contributor to the failure in early period aging test. For the long-term reliability, the degradations of phosphor and reflectivity of substrate contribute significantly on lumen depreciation. The proposed reliability assessment method with overdriving loadings can be usefully implemented for LED manufacturers to make a cost- and effective-decision before mass production. [ABSTRACT FROM AUTHOR]
Copyright of Microelectronics Reliability is the property of Pergamon Press - An Imprint of Elsevier Science and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.)
Database: Engineering Source
FullText Text:
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Header DbId: egs
DbLabel: Engineering Source
An: 125923579
AccessLevel: 6
PubType: Academic Journal
PubTypeId: academicJournal
PreciseRelevancyScore: 0
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  Data: Overdriving reliability of chip scale packaged LEDs: Quantitatively analyzing the impact of component.
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  Data: <searchLink fieldCode="AR" term="%22Tang%2C+Hongyu%22">Tang, Hongyu</searchLink><relatesTo>1,2</relatesTo><br /><searchLink fieldCode="AR" term="%22Ye%2C+Huaiyu%22">Ye, Huaiyu</searchLink><relatesTo>3,4</relatesTo><i> h.ye@tudelft.nl</i><br /><searchLink fieldCode="AR" term="%22Wong%2C+Cell+K%2EY%2E%22">Wong, Cell K.Y.</searchLink><relatesTo>2,5</relatesTo><br /><searchLink fieldCode="AR" term="%22Leung%2C+Stanely+Y%2EY%2E%22">Leung, Stanely Y.Y.</searchLink><relatesTo>2,5</relatesTo><br /><searchLink fieldCode="AR" term="%22Fan%2C+Jiajie%22">Fan, Jiajie</searchLink><relatesTo>2,6</relatesTo><br /><searchLink fieldCode="AR" term="%22Chen%2C+Xianping%22">Chen, Xianping</searchLink><relatesTo>3,4</relatesTo><br /><searchLink fieldCode="AR" term="%22Fan%2C+Xuejun%22">Fan, Xuejun</searchLink><relatesTo>7</relatesTo><br /><searchLink fieldCode="AR" term="%22Zhang%2C+Guoqi%22">Zhang, Guoqi</searchLink><relatesTo>1,5</relatesTo><i> G.Q.Zhang@tudelft.nl</i>
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  Data: <searchLink fieldCode="JN" term="%22Microelectronics+Reliability%22">Microelectronics Reliability</searchLink>. Nov2017, Vol. 78, p197-204. 8p.
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  Data: <searchLink fieldCode="DE" term="%22Light+emitting+diodes%22">Light emitting diodes</searchLink><br /><searchLink fieldCode="DE" term="%22Chip+scale+packaging%22">Chip scale packaging</searchLink><br /><searchLink fieldCode="DE" term="%22Quantitative+chemical+analysis%22">Quantitative chemical analysis</searchLink><br /><searchLink fieldCode="DE" term="%22Electronic+color+sensors%22">Electronic color sensors</searchLink><br /><searchLink fieldCode="DE" term="%22Dimensional+preference%22">Dimensional preference</searchLink>
– Name: Abstract
  Label: Abstract
  Group: Ab
  Data: The objective of this study is to quantitatively evaluate the impacts of LED components on the overdriving reliability of high power white LED chip scale packages (CSPs). The reliability tests under room temperature are conducted over 1000 h in this study on CSP LEDs with overdriving currents. A novel method is proposed to investigate the impact of various components, including blue die, phosphor layer, and substrate, on the lumen depreciation of CSP LEDs after aging test. The electro-optical measurement results show that the overdriving current can lead to both massive light output degradation and significant color shift of CSP LEDs. The quantitative analysis results show that the phosphor layer is the major contributor to the failure in early period aging test. For the long-term reliability, the degradations of phosphor and reflectivity of substrate contribute significantly on lumen depreciation. The proposed reliability assessment method with overdriving loadings can be usefully implemented for LED manufacturers to make a cost- and effective-decision before mass production. [ABSTRACT FROM AUTHOR]
– Name: AbstractSuppliedCopyright
  Label:
  Group: Ab
  Data: <i>Copyright of Microelectronics Reliability is the property of Pergamon Press - An Imprint of Elsevier Science and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract.</i> (Copyright applies to all Abstracts.)
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RecordInfo BibRecord:
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      – Type: doi
        Value: 10.1016/j.microrel.2017.09.008
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      – Code: eng
        Text: English
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        PageCount: 8
        StartPage: 197
    Subjects:
      – SubjectFull: Light emitting diodes
        Type: general
      – SubjectFull: Chip scale packaging
        Type: general
      – SubjectFull: Quantitative chemical analysis
        Type: general
      – SubjectFull: Electronic color sensors
        Type: general
      – SubjectFull: Dimensional preference
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      – TitleFull: Overdriving reliability of chip scale packaged LEDs: Quantitatively analyzing the impact of component.
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            NameFull: Tang, Hongyu
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            NameFull: Ye, Huaiyu
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            NameFull: Wong, Cell K.Y.
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            NameFull: Fan, Jiajie
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              M: 11
              Text: Nov2017
              Type: published
              Y: 2017
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              Value: 78
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