BTI mitigation by anti-ageing software patterns.

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Bibliographic Details
Title: BTI mitigation by anti-ageing software patterns.
Authors: Abbas, Haider Muhi1, Halak, Basel1, Zwolinski, Mark1
Source: Microelectronics Reliability. Dec2017, Vol. 79, p79-90. 12p.
Subjects: Temperature, Deterioration of materials, Computer software, Instruction set architecture, Integrated circuits
Abstract: This paper presents a time-redundant technique to mitigate Negative and Positive Bias Temperature Instability (NBTI/PBTI) ageing effects on the functional units of a processor. We have analysed the sources and effects of ageing from the device level to the Instruction Set Architecture (ISA) level, and have found that an application may stress the critical paths in such a way that the circuit has half of its nodes always NBTI-stressed. To mitigate this behaviour, we propose an application-level solution to balance the stress and put the timing-critical gates of the critical path into a relaxed (balanced) mode. The results show that the lifetime of the system can be doubled by applying balanced stress patterns at the software level during the idle time of a processor system. [ABSTRACT FROM AUTHOR]
Copyright of Microelectronics Reliability is the property of Pergamon Press - An Imprint of Elsevier Science and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.)
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DbLabel: Engineering Source
An: 126296580
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Items – Name: Title
  Label: Title
  Group: Ti
  Data: BTI mitigation by anti-ageing software patterns.
– Name: Author
  Label: Authors
  Group: Au
  Data: <searchLink fieldCode="AR" term="%22Abbas%2C+Haider+Muhi%22">Abbas, Haider Muhi</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AR" term="%22Halak%2C+Basel%22">Halak, Basel</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AR" term="%22Zwolinski%2C+Mark%22">Zwolinski, Mark</searchLink><relatesTo>1</relatesTo>
– Name: TitleSource
  Label: Source
  Group: Src
  Data: <searchLink fieldCode="JN" term="%22Microelectronics+Reliability%22">Microelectronics Reliability</searchLink>. Dec2017, Vol. 79, p79-90. 12p.
– Name: Subject
  Label: Subjects
  Group: Su
  Data: <searchLink fieldCode="DE" term="%22Temperature%22">Temperature</searchLink><br /><searchLink fieldCode="DE" term="%22Deterioration+of+materials%22">Deterioration of materials</searchLink><br /><searchLink fieldCode="DE" term="%22Computer+software%22">Computer software</searchLink><br /><searchLink fieldCode="DE" term="%22Instruction+set+architecture%22">Instruction set architecture</searchLink><br /><searchLink fieldCode="DE" term="%22Integrated+circuits%22">Integrated circuits</searchLink>
– Name: Abstract
  Label: Abstract
  Group: Ab
  Data: This paper presents a time-redundant technique to mitigate Negative and Positive Bias Temperature Instability (NBTI/PBTI) ageing effects on the functional units of a processor. We have analysed the sources and effects of ageing from the device level to the Instruction Set Architecture (ISA) level, and have found that an application may stress the critical paths in such a way that the circuit has half of its nodes always NBTI-stressed. To mitigate this behaviour, we propose an application-level solution to balance the stress and put the timing-critical gates of the critical path into a relaxed (balanced) mode. The results show that the lifetime of the system can be doubled by applying balanced stress patterns at the software level during the idle time of a processor system. [ABSTRACT FROM AUTHOR]
– Name: AbstractSuppliedCopyright
  Label:
  Group: Ab
  Data: <i>Copyright of Microelectronics Reliability is the property of Pergamon Press - An Imprint of Elsevier Science and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract.</i> (Copyright applies to all Abstracts.)
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RecordInfo BibRecord:
  BibEntity:
    Identifiers:
      – Type: doi
        Value: 10.1016/j.microrel.2017.10.009
    Languages:
      – Code: eng
        Text: English
    PhysicalDescription:
      Pagination:
        PageCount: 12
        StartPage: 79
    Subjects:
      – SubjectFull: Temperature
        Type: general
      – SubjectFull: Deterioration of materials
        Type: general
      – SubjectFull: Computer software
        Type: general
      – SubjectFull: Instruction set architecture
        Type: general
      – SubjectFull: Integrated circuits
        Type: general
    Titles:
      – TitleFull: BTI mitigation by anti-ageing software patterns.
        Type: main
  BibRelationships:
    HasContributorRelationships:
      – PersonEntity:
          Name:
            NameFull: Abbas, Haider Muhi
      – PersonEntity:
          Name:
            NameFull: Halak, Basel
      – PersonEntity:
          Name:
            NameFull: Zwolinski, Mark
    IsPartOfRelationships:
      – BibEntity:
          Dates:
            – D: 01
              M: 12
              Text: Dec2017
              Type: published
              Y: 2017
          Identifiers:
            – Type: issn-print
              Value: 00262714
          Numbering:
            – Type: volume
              Value: 79
          Titles:
            – TitleFull: Microelectronics Reliability
              Type: main
ResultId 1