APA (7th ed.) Citation

Baïri, A., Haddad, O., Guinart, J., Adeyeye, K., & Alilat, N. (2018). Effects of the Encapsulating Resin on the Junction Temperature of the QFN16 and QFN32 Electronic Packages Subjected to Free Convection. Heat Transfer Engineering, 39(4), 353. https://doi.org/10.1080/01457632.2017.1305834

Chicago Style (17th ed.) Citation

Baïri, Abderrahmane, Oriana Haddad, Jean-Pascal Guinart, Kemi Adeyeye, and Nacim Alilat. "Effects of the Encapsulating Resin on the Junction Temperature of the QFN16 and QFN32 Electronic Packages Subjected to Free Convection." Heat Transfer Engineering 39, no. 4 (2018): 353. https://doi.org/10.1080/01457632.2017.1305834.

MLA (9th ed.) Citation

Baïri, Abderrahmane, et al. "Effects of the Encapsulating Resin on the Junction Temperature of the QFN16 and QFN32 Electronic Packages Subjected to Free Convection." Heat Transfer Engineering, vol. 39, no. 4, 2018, p. 353, https://doi.org/10.1080/01457632.2017.1305834.